Google Android 6.0.1 (Marshmallow), 2150 MHz, Qualcomm Snapdragon 820 MSM8996, 6.00 GiB RAM, 64.0 GB ROM, 1080x1920, 5.5 inch, 15.9 MP cam, 8.0 MP sec. cam, 3000 mAh

Apple Watch OS 3, Apple S2, 512 MiB RAM, 4.0 GB ROM, 272x340, 1.3 inch, 273 mAh

Google Android 7.0 (Nougat), 2150 MHz, Qualcomm Snapdragon 820 MSM8996, 4.00 GiB RAM, 64.0 GB ROM, 1440x2560, 5.7 inch, 1040x160 px, 16.3 MP cam, 8.0 MP aux. cam, 5.0 MP sec. cam, 3200 mAh

Apple iOS 10, 2300 MHz, Apple A10 Fusion APL1024, 2.00 GiB RAM, 128.0 GB ROM, 750x1334, 4.7 inch, 12.0 MP cam, 7.1 MP sec. cam, 1960 mAh

Google Android 6.0 (Marshmallow), 2000 MHz, Qualcomm Snapdragon 625 MSM8953, 3.00 GiB RAM, 32.0 GB ROM, 1080x1920, 5 inch, 12.0 MP cam, 8.0 MP sec. cam, 3020 mAh

Apple iOS 10, 1490 MHz, Apple A8 APL1011 (T7000), 2.00 GiB RAM, 32.0 GB ROM, 1536x2048, 7.9 inch, 8.0 MP cam, 1.2 MP sec. cam, 5100 mAh

Samsung GT-P7510 Galaxy Tab 10.1 Wi-Fi 16GB


General Attributes

Released 2011 Jun
Hardware designerThe company which designed this device Samsung Electronics
ManufacturerThe company which produces this device Samsung Electronics
OEM IDThe OEM ID is internal code and refers to a specific variant of the model series P7510-M16
Device Category:  TabletHandheld touchscreen mobile computer which is able to natively run third-party applications and does not support voice calling without headset or speakerphone.
Market CountriesCountries where the device was officially sold. Overlap is possible. USA

Physical Attributes

WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 256.7 mm
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 175.3 mm
DepthDepth or thickness is usually the smallest dimension of the device 8.6 mm
DimensionsAll dimensions are maximal values (measured between the furthest points of the device) in closed state 10.11x6.90x0.34 inches
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 565 g
19.93 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software Environment

Embedded Operating SystemPre-installed operating system which the device was released with. Google Android 3.1 (Ice Cream)Google Android 3.1 (Ice Cream)
Operating System KernelThe OS kernel is the primary component of an operating system which manages hardware and software resources, schedules tasks and threads and provides interface for the upper software layers (system calls, interrupts, APIs, etc.)

Application processor, Chipset

CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 1000 MHz
CPUManufacturer part number of the IC which includes the main application processor os processors NVIDIA Tegra 2 250 T20 (Ventana), 2010, 32 bit, dual-core, 32 Kbyte I-Cache, 32 Kbyte D-Cache, 1024 Kbyte L2, 40 nm, NVIDIA GeForce ULP GPUNVIDIA Tegra 2 250 T20 (Ventana), 2010, 32 bit, dual-core, 32 Kbyte I-Cache, 32 Kbyte D-Cache, 1024 Kbyte L2, 40 nm, NVIDIA GeForce ULP GPU

Operative Memory
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM). LPDDR2 SDRAM
RAM Capacity (converted)RAM capacity in binary bytes (KiB: 1024 bytes, MiB: 1024 KiB, GiB: 1024 MiB) 1.00 GiB RAM

Non-volatile Memory
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance Flash EEPROM
Non-volatile Memory Capacity (converted)The value of ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) 16.4 GB ROM

DisplayAll parameters that related to display

Display ResolutionHorizontal and vertical resolution of the primary display 1280x800
Display DiagonalThe distance measured between the furthest corners of the display 255.4 mm
10.1 inch
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 40.12 mm
Display Area UtilizationDisplay area per front panel area ratio 65%
Pixel DensityIndicates the number of pixels per inch 150 PPI
Display TypeDisplay Type Color TN-TFT LCDColor TN-TFT (Twisted Nematic - Thin Film Transistor). This is an active matrix LCD technology.
Number of Display Colors/ScalesMaximal number of displayable colors or scales 16.8M
Display Subpixel Scheme:  RGB MatrixEach pixel has 3 subpixel (Red, Greed, Blue) with the same size. The subpixel order is often R-G-B but B-G-R is also used.
Scratch Resistant Screen:  Gorilla Glass

Graphical Suybsystem
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset NVIDIA GeForce

Audio/Video Interfaces
A/V OutBuilt-in Audio/Video outputs (A/V out) form a very heterogeneous group of interfaces that allow the user to connect the mobile device to various external analog/digital multimedia devices (monitors, projectors, TVs, HD TVs) and play multimedia content. No

Audio Subsystem

Microphone(s):  mono
Loudpeaker(s):  stereo

Cellular Phone

Supported Cellular NetworksList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands. No

Secondary Cellular Phone
Sec. Supported Cellular Networks:  No

Control Peripherals

Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen Capacitive multi-touch
Touchscreen Simultaneous Touch PointsDetermines how many touches the touch-sensitive screen module is able to simultaneously detect Yes

Communication Interfaces

Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces No
USBUSB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard. USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB Speed Rate:  USB HS (480 Mbps)
USB Services:  USB chargingThe device is able to charge its battery supplied from the USB port.
USB Connector:  micro-USB
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. Bluetooth 3.0
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer 802.11a, 802.11b, 802.11g, 802.11n
Wireless Services:  DLNADLNA (Digital Living Network Alliance) over Wireless LAN

Multimedia Broadcast

Analog Radio Receiver:  No

Satellite Navigation

Built-in Digital CameraPrimary camera usually has better imaging capabilities than secondary camera if any

Camera Image SensorRefers to the semiconductor technology of image sensor CMOSComplementary MOS circuit
Number of pixels 3.1 MP cam
Optical ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1 x
Focus:  CD AFContrast-detection (CD) is a passive autofocus method without distance measurement which adjusts the optical system until maximum contrast is measured through the lens.
Auxiliary LightA flash is used to brighten dark areas when taking photographs; is also used as a flashlight mobile light (LED)
Camcorder Resolution 1280x720 pixel
30 fps
Camera Extra Functions:  Macro modeAn autofocus feature that allows for close-up photographs to be taken with the onboard digital camera
Camera PlacementRefers to the placement of the primary camera on the device Rear

Built-in Secondary Digital CameraWidely used for video telephony or taking selfies

Secondary Camera Sensor:  CMOSComplementary MOS circuit
Secondary Number of pixels 1.9 MP sec. cam
Secondary Camera Placement:  Front

Power Supply

BatteryBattery technology Lithium-ion polymer
Battery Capacity 6860 mAh

Ingress Protection

Protection from solid materials:  Yes
Protection from liquids:  Yes

Built-in Sensors

Built-in compass:  Yes
Built-in accelerometerAn internal component that senses acceleration components of the device.  Used for automatic screen rotation and for games and applications that rely on acceleration measurement  on X, Y, and Z axis Yes
Built-in gyroscopeAn internal component that senses the orientation of the device.  Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis Yes

Datasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Preliminary