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M3Mobile M3 Edu MC-1100

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General Attributes

BrandBrand name of the device. This may match with the manufacturer M3Mobile
ModelOne or more (separated by /) specific model name identifies this device M3 Edu MC-1100
ReleasedOfficial release date 2011 Aug
Hardware designerThe company which designed this device Mobile Compia
ManufacturerThe company which produces this device Mobile Compia
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc. Yes
Market CountriesCountries where the device was officially sold. Overlap is possible. Japan

Physical Attributes

WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 70 mm
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 115 mm
DepthDepth or thickness is usually the smallest dimension of the device 15.8 mm
DimensionsAll dimensions are maximal values (measured between the furthest points of the device) in closed state 2.76x4.53x0.62 inches
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 180 g
6.35 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software Environment

Operating SystemPre-installed (usually embedded) operating system which the device was released with. Microsoft Windows CE 5.0 (Macallan)Microsoft Windows CE 5.0 (Macallan)

Application processor, Chipset

CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 806 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Marvell PXA320 (Monahans P), 2007, 32 bit, single-core, 256 Kbyte L2Marvell PXA320 (Monahans P), 2007, 32 bit, single-core, 256 Kbyte L2

Operative Memory
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM). Yes
RAM Capacity (converted)RAM capacity in binary bytes (KiB: 1024 bytes, MiB: 1024 KiB, GiB: 1024 MiB) 128 MiB RAM

Non-volatile Memory
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance Flash EEPROM
Non-volatile Memory Capacity (converted)The value of ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) 1024 MiB ROM

DisplayAll parameters that related to display

Display ResolutionHorizontal and vertical resolution of the primary display 240x320
Display DiagonalThe distance measured between the furthest corners of the display 89 mm
3.5 inch
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 16.6 mm
Display Area UtilizationDisplay area per front panel area ratio 47%
Pixel DensityIndicates the number of pixels per inch 114 PPI
Display TypePossible options: Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT, etc. Color TN-TFT LCDColor TN-TFT (Twisted Nematic - Thin Film Transistor). This is an active matrix LCD technology.
Number of Display Colors/ScalesMaximal number of displayable colors or scales 262144
Display Subpixel SchemeSpecifies how and how many subpixels are pixels consists of. Possible schemes: RGB, RGBG, RGBW, PenTile, Diamond Pixel, etc. RGB MatrixEach pixel has 3 subpixel (Red, Greed, Blue) with the same size. The subpixel order is often R-G-B but B-G-R is also used.
Scratch Resistant ScreenPossible types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass, etc. No

Graphical Suybsystem

Audio/Video Interfaces
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e No

Audio Subsystem

Microphone(s) mono
Loudpeaker(s) mono

Cellular Phone

Supported Cellular NetworksList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands. UMTS2100 (B1)UMTS2100 phones support UMTS 1900 / 2100MHz (IMT, also refferred as UMTS Band I) band (downlink: 2112.4 - 2167.6 MHz, uplink: 1922.4-1977.6 MHz)
Supported Cellular Data LinksList of supported cellular data links and rates. UMTSUniversal Mobile Telecommunications System. UMTS Release '99 data link layer, W-CDMA grants up to 384 kbit/s pocket-switched download speed.
SIM Card SlotSupported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc. Yes

Secondary Cellular Phone
Sec. Supported Cellular Networks No

Control Peripherals

Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen Resistive
Touchscreen Simultaneous Touch PointsDetermines how many touches the touch-sensitive screen module is able to simultaneously detect Single-touch
Directional PadA four-way mechanism that allows the selection of certain on-screen objects 5-way

Communication Interfaces

Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc. microSDSupports memory cards with capacity of up to 2GB and may comply with some (not HC) memory cards with higher capacity than 2GB  , microSDHCA micro-SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB., TransFlash
USBUSB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard. USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB Speed Rate:  USB HS (480 Mbps)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc. USB chargingThe device is able to charge its battery supplied from the USB port.
USB Connector:  Proprietary
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version. No
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (like 802.11n). No

Multimedia Broadcast

FM Radio Receiver No

Satellite Navigation


Built-in Digital CameraPrimary camera usually has better imaging capabilities than secondary camera if any

Camera PlacementRefers to the placement of the primary camera on the device Rear
Camera Image SensorRefers to the semiconductor technology of image sensor CMOSComplementary MOS circuit
Number of pixels 1.9 MP cam
Optical ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1 x
FocusPossible focus methods: fixed focus, manual focus, CD AF, PD AF, LASER AF, etc. FixedNon-adjustable optical system
Camcorder Resolution 320x240 pixel
Built-in FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight No

Built-in Secondary Digital CameraWidely used for video telephony or taking selfies

Secondary Camera Sensor No

Power Supply

BatteryBattery technology Lithium-ion
removablePossible options: removable, built-in
Nominal Battery Capacity 1920 mAh

Ingress Protection

Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials Non-standard protection
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids Non-standard protection

Built-in Sensors


Datasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Preliminary
AddedThe exact time of the datasheet addition 2011-12-03 16:32