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Device Database: Comparison Sheet (2)

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Pantech DUO C810 (Pantech Mustang)
Pantech Matrix PRO (Pantech Mustang 2)
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Pantech DUO C810  (Pantech Mustang)
Pantech Matrix PRO  (Pantech Mustang 2)
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General Attributes
ReleasedOfficial release date 2007 Nov 2009 Feb
Hardware designerThe company which designed this device Pantech Curitel Pantech Curitel
ManufacturerThe company which produces this device Pantech Curitel Pantech Curitel
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc. Smartphone Smartphone
Market CountriesCountries where the device was officially sold. Overlap is possible. No USA

Physical Attributes
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 50 mm 51 mm
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 102 mm 106 mm
DepthDepth or thickness is usually the smallest dimension of the device 21.1 mm 21.6 mm
Dimensions 1.97x4.02x0.83 inches 2.01x4.17x0.85 inches
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 110 g 122 g
3.88 ounces 4.3 ounces

Software Environment
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Microsoft Windows Mobile 6 Standard (Crossbow) Microsoft Windows Mobile 6.1 Standard

Application processor, Chipset
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 416 MHz 528 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Intel XScale PXA270 (Bulverde), 2004, 32 bit, single-core, 32 Kbyte I-Cache, 32 Kbyte D-Cache Qualcomm MSM7201A, 2008, 32 bit, single-core, 65 nm, Qualcomm Adreno 130 GPU

Operative Memory
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM). SDRAM SDRAM
RAM Capacity (converted)RAM capacity in binary bytes (KiB: 1024 bytes, MiB: 1024 KiB, GiB: 1024 MiB) 64 MiB RAM 128 MiB RAM
68 MiB user accessible

Non-volatile Memory
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance Flash EEPROM Flash EEPROM
Non-volatile Memory Capacity (converted)The value of ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) 128 MiB ROM 256 MiB ROM
Total non-volatile user storageThe sum of primary and secondary user-accessible partition of non-volatile storage spaces 50 MiB total user storage

DisplayAll parameters that related to display
Display ResolutionHorizontal and vertical resolution of the primary display 240x320 240x320
Display DiagonalThe distance measured between the furthest corners of the display 56 mm 61 mm
2.2 inch 2.4 inch
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 16.4 mm 14.4 mm
Display Area UtilizationDisplay area per front panel area ratio 30% 33%
Pixel DensityIndicates the number of pixels per inch 181 PPI 167 PPI
Display TypePossible options: Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT, etc. Color TN-TFT LCD Color TN-TFT LCD
Number of Display Colors/ScalesMaximal number of displayable colors or scales 262144 262144
Display Subpixel SchemeSpecifies how and how many subpixels are pixels consists of. Possible schemes: RGB, RGBG, RGBW, PenTile, Diamond Pixel, etc. RGB Matrix RGB Matrix

Graphical Suybsystem
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset Qualcomm Adreno 130

Audio/Video Interfaces

Audio Subsystem
Microphone(s) mono mono
Loudpeaker(s) mono mono

Cellular Phone
Supported Cellular NetworksList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands. GSM850, GSM900, GSM1800, GSM1900, UMTS850 (B5), UMTS1900 (B2) GSM850, GSM900, GSM1800, GSM1900, UMTS850 (B5), UMTS1900 (B2), UMTS2100 (B1)
Supported Cellular Data LinksList of supported cellular data links and rates. CSD, GPRS, GPRS C10, EDGE, UMTS, HSDPA CSD, GPRS, GPRS C10, EDGE, UMTS, HSDPA, HSUPA
SIM Card SlotSupported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc. Mini-SIM (2FF) Mini-SIM (2FF)
Complementary Phone ServicesPossible extras: voice transmission, voice speaker, vibration, speakerphone, active noise cancellation, PTT, HD Voice, VoLTE, etc. Voice transmission, Voice speaker, Vibrate, Speakerphone Voice transmission, Voice speaker, Vibrate, Speakerphone
SAR (head)Measured SAR value at head configuration 0.467 W/kg
SAR (body)Measured SAR value at body onfiguration 1.120 W/kg

Secondary Cellular Phone

Control Peripherals
KeyboardConventional input peripheral which allows the user to enter characters by pressing a dedicated key Slide-out QWERTY Slide-out QWERTY
Number of keys 35 35
Directional PadA four-way mechanism that allows the selection of certain on-screen objects 4-way 5-way
Scroll WheelScroll Wheel, jog and rotary machanisms to help user with scrolling on the screen No Optical trackpad

Communication Interfaces
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc. microSD, TransFlash, SDIO microSD, microSDHC, TransFlash, SDIO
USBUSB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard. USB 1.1 USB 2.0
USB Speed Rate USB FS (12 Mbps) USB FS (12 Mbps)
USB Services USB charging USB charging
USB Connector Proprietary Proprietary
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version. Bluetooth 1.2 Bluetooth 2.0

Multimedia Broadcast

Satellite Navigation
Complementary GPS ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc. No A-GPS

Built-in Digital CameraPrimary camera usually has better imaging capabilities than secondary camera if any
Camera PlacementRefers to the placement of the primary camera on the device Rear Rear
Camera Image SensorRefers to the semiconductor technology of image sensor CMOS CMOS
Number of pixels 1.3 MP cam 1.9 MP cam
Optical ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1 x 1 x
FocusPossible focus methods: fixed focus, manual focus, CD AF, PD AF, LASER AF, etc. Fixed Fixed
Camcorder Resolution 320x240 pixel 320x240 pixel
Built-in FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight single LED No

Built-in Secondary Digital CameraWidely used for video telephony or taking selfies

Power Supply
BatteryBattery technology Lithium-ion Lithium-ion
removable removable
Nominal Battery Capacity 1320 mAh 1320 mAh
Estimated Average CurrentEstimated Average Current is derived from battery life and battery capacity. This current is consumed while the device is used in the following state: screen backlight on (mid-level), phone (if any) on, no phone calls, no multimedia, continuous user input 88 mA
Estimated Battery Life 15 hours

Ingress Protection
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials Yes Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids Yes Yes

Built-in Sensors

Datasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Final Final
AddedThe exact time of the datasheet addition 2007-10-18 00:31 2008-05-06 11:38