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Device Specs: Referred (not editable) comparison sheet [2]

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Sprint HTC One M8 2014 TD-LTE (HTC M8)
Sprint HTC 10 TD-LTE (HTC Perfume)
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Sprint HTC One M8 2014 TD-LTE  (HTC M8)
Sprint HTC 10 TD-LTE  (HTC Perfume)
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IntroductionIntroduction
ReleasedFirst official market release date in (year, month) 2014 Apr 11 2016 May 13
Hardware DesignerThe company which designed this device HTC HTC
ManufacturerThe company which produces this device HTC HTC
OEM IDThe OEM ID is internal code and refers to a specific variant of the model series 0P6B700 2PS6400
General ExtrasHardware extras like stylus, kickstand, rotatatble screen, rotatable keyboard, haptic feedback, etc. No Haptic touch feedback
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc. Smartphone Smartphone

Physical AttributesPhysical Attributes
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 70.6 mm 71.9 mm
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 146.36 mm 145.9 mm
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 9.35 mm 9 mm
Dimensions 2.78x5.76x0.37 inches 2.83x5.74x0.35 inches
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 160 g 161 g
5.64 ounces 5.68 ounces

Software EnvironmentSoftware Environment
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc. Android Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 4.4.2 (KitKat) Google Android 6.0.1 (Marshmallow)

Application processor, ChipsetApplication processor, Chipset
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 2265 MHz 2150 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Qualcomm Snapdragon 801 MSM8974AB v3, 2014, 32 bit, quad-core, 16 Kbyte I-Cache, 16 Kbyte D-Cache, 2048 Kbyte L2, 28 nm, Qualcomm Adreno 330 GPU Qualcomm Snapdragon 820 MSM8996, 2015, 64 bit, quad-core, 32 Kbyte I-Cache, 32 Kbyte D-Cache, 1536 Kbyte L2, 14 nm, Qualcomm Adreno 530 GPU

Operative MemoryOperative Memory
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM). LPDDR3 SDRAM LPDDR4 SDRAM
933 MHz
RAM Capacity (converted)RAM capacity in binary bytes (KiB: 1024 bytes, MiB: 1024 KiB, GiB: 1024 MiB) 2 GiB RAM 4 GiB RAM



Non-volatile MemoryNon-volatile Memory
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory Yes Yes
Non-volatile Memory Capacity (converted)The value of ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) 32 GB ROM 32 GB ROM
24600 MiB total user storage

DisplayDisplayAll parameters that related to display
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 127 mm 132 mm
5 inch 5.2 inch
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 1080x1920 1440x2560
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 8.34 mm 7.19 mm
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 66.7% 71.0%
Pixel DensityIndicates the number of pixels per inch 441 PPI 565 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT Color PVA TFT LCD display Color PVA TFT LCD display
Display Subtype SLCD3 SLCD5
Number of Display ScalesMaximal number of displayable colors or scales 16.8M 16.8M
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass Gorilla Glass 3 Gorilla Glass 4

Graphical SubsystemGraphical Subsystem
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset Qualcomm Adreno 330 Qualcomm Adreno 530
Dedicated Graphics MemoryDedicated operative memory (video RAM, VRAM) of graphics controller or GPU which independent from the op. memory of the main processor. Graphics controller may have access to the main RAM (shared RAM) too 0.5 MiB 1 MiB
GPU Clock 578 MHz

Audio/Video InterfacesAudio/Video Interfaces
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e MHL DisplayPort
micro-USB USB Type-C reversible

Audio SubsystemAudio Subsystem
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification stereo 3
Loudspeaker(s) stereo stereo
Audio Output 3.5mm 3.5mm

Cellular PhoneCellular Phone
Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands. GSM850, GSM900, GSM1800, GSM1900, UMTS2100 (B1), UMTS1900 (B2), UMTS850 (B5), CDMA800 (BC0), CDMA1900 (BC1/BC14), LTE1800 (B3), LTE1900 (B25), LTE850 (B26), TD-LTE2500 (B41) bands CDMA800 (BC0), CDMA1900 (BC1/BC14), CDMA800 (BC10), LTE1900 (B2), LTE1700/2100 (B4), LTE850 (B5), LTE2600 (B7), LTE700 (B12), LTE700 (B13), LTE1900 (B25), LTE850 (B26), TD-LTE2500 (B41) bands
Supported Cellular Data LinksList of supported cellular data links and rates. GPRS, EDGE, UMTS, HSUPA, HSUPA 5.8, HSDPA, HSDPA 14.4, cdmaOne, CDMA2000 1x, CDMA2000 1xEV-DO, CDMA2000 1xEV-DO Rev A, LTE, LTE 150/50 data links cdmaOne, CDMA2000 1x, CDMA2000 1xEV-DO, CDMA2000 1xEV-DO Rev A, LTE data links
SIM Card SlotSupported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc. Nano-SIM (4FF) Nano-SIM (4FF)
Complementary Phone ServicesPossible extras: voice transmission, voice speaker, vibration, speakerphone, active noise cancellation, PTT, HD Voice, VoLTE, etc. Voice transmission, Voice speaker, Vibrate, Speakerphone, ANC, HD Voice Voice transmission, Voice speaker, Vibrate, Speakerphone, ANC
SAR (head)Measured SAR value at head configuration 0.790 W/kg
SAR (body)Measured SAR value at body configuration 0.620 W/kg

Secondary Cellular PhoneSecondary Cellular Phone

Control PeripheralsControl Peripherals
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen Capacitive multi-touch screen Capacitive multi-touch screen

Communication InterfacesCommunication Interfaces
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc. TransFlash, microSD, microSDHC, microSDXC TransFlash, microSD, microSDHC, microSDXC
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard. USB 2.0 USB 3.0 / 3.1 Gen 1 / 3.2 Gen 1x1
USB HS (480 Mbps) USB SS (5 Gbps)
USB Services USB charging, USB Host, USB OTG 1.3, USB PD USB charging, USB fast charging, USB Host, USB OTG 2.0, USB PD
USB Connector USB Micro-AB USB C reversible
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version. Bluetooth 4.0 Bluetooth 4.2
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n). 802.11a, 802.11b, 802.11g, 802.11n, 802.11ac 802.11a, 802.11b, 802.11g, 802.11n, 802.11ac
Wireless Services DLNA, Wi-Fi Tethering DLNA, Miracast, Wi-Fi Direct, Wi-Fi Tethering
NFCNear Field Communication is short-range wireless radio data exchange technology based on radio-frequency identification (RFID). This field enumerates the supported NFC technologies. Yes Yes
IRInfrared Port (IR): Near-field (within 1 meter) wireless optical data link mainly for connecting mobile devices, accessories and consumer electronic devices (remote control). Yes No
Yes No

Multimedia BroadcastMultimedia Broadcast
FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band. FM radio (76-108 MHz) with RDS No

Satellite NavigationSatellite Navigation
Complementary Satellite ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc. Simultaneous GPS, A-GPS, Geotagging, QuickGPS Simultaneous GPS, A-GPS, Geotagging, QuickGPS
Supported GLONASS protocol(s)GLONASS is a global satellite  navigation system operated by Russia. L1OF L1OF

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any
Camera PlacementRefers to the placement of the primary camera on the device. Front, rear or rotatable. Generally rear. Rear Rear
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.) BSI CMOS BSI CMOS
Image Sensor Pixel SizePixel size of the primary camera sensor 2.00 micrometer 1.55 micrometer
Number of effective pixelsA measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 4.1 MP camera 12.0 MP camera
Aperture (W)Wide-angle aperture of lens or aperture of lens in case of camera without optical zoom f/2.00 f/1.80
ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1.0 x optical zoom 1.0 x optical zoom
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all CD AF Laser AF
Min. Equiv. Focal LengthMinimum focal length (35 mm equivalent) of lens or fixed focal length (35 mm equivalent) in case of lens without optical zoom. 28 mm
Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the primary camera can capture video 1920x1080 pixel 3840x2160 pixel
60 fps 30 fps
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash. single LED dual LED
Camera Extra FunctionsPopular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch EIS, OIS, HDR photo, HDR video, Macro mode, Face detection, Smile detection OIS, HDR photo, HDR video, Slow motion video, Macro mode, Face detection, Smile detection
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup Yes No
Aux. Camera Number of Pixels Number of effective pixels of Auxiliary Camera (2nd camera of primary camera system) in at least dual lens camera setup 2.1 MP aux. cam

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies
Secondary Camera PlacementRefers to the placement of the secondary camera on the device. Front or rear. Generally front camera for selfies or video call. Front Front
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.) CMOS BSI CMOS
Secondary Camera Number of pixelsA measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 5.0 MP sec. cam 5.0 MP sec. cam
Secondary Aperture (W)Wide-angle aperture of lens or aperture of lens in case of secondary camera without optical zoom f/1.80
Secondary Camera FocusFocus methods of secondary camera No CD AF
Secondary Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can capture video 1920x1080 pixel 1920x1080 pixel
30 fps 30 fps
Secondary Camera Extra FunctionsPopular extra features of the secondary camera: Face detection, HDR photo, Selfie Panorama, Smile detection, Face Retouch / Face Beautification No OIS

Built-in SensorsBuilt-in Sensors
Built-in compassBuilt-in electroinc compass types: 1D, 2D, 3D Yes Yes
Built-in accelerometerAn internal component that senses acceleration components of the device.  Used for automatic screen rotation and for games and applications that rely on acceleration measurement  on X, Y, and Z axis. Possible types: 1D, 2D, 3D Yes Yes
Built-in gyroscopeAn internal component that senses the orientation of the device.  Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D Yes Yes
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors Barometer, L sensor, P sensor FP sensor, L sensor, P sensor

Ingress ProtectionIngress Protection
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials Non-standard protection 5 Protected against dust with limited ingress
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids 3 Protection against direct sprays up to 60 degrees from the vertical 3 Protection against direct sprays up to 60 degrees from the vertical

Power SupplyPower Supply
BatteryBattery technology Li-ion polymer (LiPo) Li-ion polymer (LiPo)
built-in built-in
1-cell 1-cell
Nominal Battery VoltageIf there are more than 1 cells in the battery in series connection the nominal resulting battery voltage is the sum of voltage of cells 3.80 Volts
Nominal Battery CapacityIf there are more than 1 cells in the battery in parellel connection the nominal resulting battery capacity is the sum of capacity of cells 2600 mAh battery 3000 mAh battery
Nominal Battery EnergyThe product of battery capacity and nominal voltage determines the maximal nominal stored energy in the battery 9.88 Wh

Geographical AttributesGeographical Attributes
Market CountriesCountries where the device was officially sold. Overlap is possible. USA USA
Market RegionsRegions where the device was officially sold.  Overlap is possible. North America North America
Mobile OperatorList of mobile operators (carriers) or distributors which sold the device in their own network Sprint Nextel Corporation Sprint Nextel Corporation

Datasheet AttributesDatasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Final Preliminary
AddedThe exact time of the datasheet addition 2014-03-25 19:38 2016-05-03 13:40

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