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Texas Instruments OMAP 4460

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Generel Characteristics
DesignerCompany which designed the semiconductor component Texas Instruments
Type OMAP 4460
FabPlant which fabricates the semiconductor component Texas Instruments
Year Released 2011
FunctionMain function of the component Multi-core Application Processor

ArchitectureArchitecture
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit
Supported Instruction Set(s) ARMv7
Pipeline StagesPipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions. 8 pipeline stages
Type of processor core(s)Type and allocation of processor core(s) 2x ARM Cortex-A9 MPCore
Number of processor core(s) dual-core


BusesBuses
Memory Interface(s) LPDDR2 SDRAM
Number of data bus channels 1 ch

Clock FrequenciesClock Frequencies
Recommended Maximum Clock Frequency 1500 MHz max.

Cache MemoriesCache Memories

Technology and Packaging
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 45 nm
Semiconductor Technology CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor

Additional Features
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). IMG PowerVR SGX GPU
Number of GPU cores 1-core GPU
GPU Clock 300 MHz
Special Features dual ARM Cortex-A9 Harvard Superscalar processor core, LPDDR2..


Datasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Preliminary
AddedThe exact time of the datasheet addition 2011-06-12 14:10
 
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