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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Intel
Type Core 3rd Gen i5-3337U
Codename Ivy Bridge
Year Released 2013
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) IA-64 (x86-64), MMX, SSE, SSE2, SSE3, SSE4, SSE 4.1
Number of processor core(s) 2
Type of processor core(s)Type and allocation of processor core(s) 2x Intel Core i5

BusesBuses: 
Memory Interface(s):   DDR3 SDRAM , DDR3L (LV) SDRAM , DDR3L-RS SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 800 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 64 bit
Number of data bus channels 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 25.6 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  Yes


Clock FrequenciesClock Frequencies: 
Recommended Minimum Clock Frequency 1800 MHz min.
Recommended Maximum Clock Frequency 2700 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 32 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 512 Kbyte L2
Total L3 Cache 3072 Kbyte L3

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 22 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component Intel
PinsNumber of pins on the package 1023 pins

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Intel HD Graphics 4000 GPU
GPU Clock 350 MHz GPU

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  No

Communication InterfacesCommunication Interfaces: 
Supported USB Specification:   No
Bluetooth supportThis field specifies the supported BT version  No
Wireless LAN supportThis field enumerates the supported Wi-Fi protocols  No
Supported Audio/Video Interface:   No

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s):   No

Additional InformationAdditional Information: 
Special Features
Dual Intel Core i5 processor cores, 32 Kbyte instruction cache per core, 32 Kbyte data cache per core, 256 Kbyte L2 cache per core, 3 Mbyte L3 Intel Smart Cache, dual-channel 64-bit 667 MHz DDR3L-RS / 800 MHz DDR3/DDR3L SD RAM interface (max. 25.6 GB/s), Intel Hyper-Threading Technology, Intel Turbo Boost 2.0 Technology, 350 MHz Intel HD Graphics 4000 GPU (max. 1100 MHz), Intel Clear Video HD Technology, Intel Wireless Display, Intel Insider, Intel InTru 3D Technology, Intel Quick Sync Video, Image Signal Processor, eDP/DP/HDMI/SDVO/CRT output support

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2014-07-31 18:47
 
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