Generel Characteristics:
|
Designer![Company which designed the semiconductor component Company which designed the semiconductor component](icons/10x10/info_gray.gif) |
Intel |
Type: |
Celeron 2955U |
Codename: |
Haswell |
Year Released: |
2013 |
Function |
Multi-core Application Processor |
Architecture:
|
Width of Machine Word![Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. Maximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors.](icons/10x10/info_gray.gif) |
64 bit |
Supported Instruction Set(s): |
IA-64 (x86-64), MMX, SSE, SSE2, SSE3, SSE4, SSE 4.1, SSE 4.2 |
Number of processor core(s): |
2 |
Type of processor core(s)![Type and allocation of processor core(s) Type and allocation of processor core(s)](icons/10x10/info_gray.gif) |
2x Intel Haswell |
Buses:
|
Memory Interface(s): |
DDR3L (LV) SDRAM
, mobile (LP) DDR3 SDRAM |
Max. Clock Frequency of Memory IF![Clock frequency of fastest supported memory interface Clock frequency of fastest supported memory interface](icons/10x10/info_gray.gif) |
800 MHz |
Data Bus Width![Maximum selectable bit width of primary data bus (RAM) of memory interface Maximum selectable bit width of primary data bus (RAM) of memory interface](icons/10x10/info_gray.gif) |
64 bit |
Number of data bus channels: |
1 ch |
Max. Data Rate![Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. Maximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units.](icons/10x10/info_gray.gif) |
12.8 Gbyte/s |
Non-volatile Memory Interface |
Yes |
Clock Frequencies:
|
Recommended Maximum Clock Frequency: |
1400 MHz max. |
Cache Memories:
|
Total L3 Cache: |
2048 Kbyte L3 |
Technology and Packaging:
|
Feature Size![The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology The minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology](icons/10x10/info_gray.gif) |
22 nm |
Semiconductor Technology: |
CMOS![Complementary Metal-oxide - Semiconductor Field Effect Transistor Complementary Metal-oxide - Semiconductor Field Effect Transistor](icons/10x10/info_gray.gif) |
Fab![Plant which fabricates the semiconductor component Plant which fabricates the semiconductor component](icons/10x10/info_gray.gif) |
Intel |
Pins![Number of pins on the package Number of pins on the package](icons/10x10/info_gray.gif) |
1168 pins |
Graphical Subsystem:
|
Embedded GPU![Manufactuer (or IP designer) and type of embedded graphics coprocessor(s). Manufactuer (or IP designer) and type of embedded graphics coprocessor(s).](icons/10x10/info_gray.gif) |
Intel HD Graphics GPU |
GPU Clock: |
200 MHz GPU |
Cellular Communication:
|
Supported Cellular Data Links |
No |
Communication Interfaces:
|
Supported USB Specification: |
No |
Bluetooth support |
No |
Wireless LAN support |
No |
Supported Audio/Video Interface: |
No |
Satellite Navigation:
|
Supported GPS protocol(s): |
Yes |
Additional Information:
|
Special Features: Dual Intel Haswell processor cores, 512 Kbyte L2 Cache per core, 2 Mbyte SmartCache, 64-bit 800 MHz dual-channel DDR3L-1600 / LP-DDR3-1600 SD RAM interface (max. 25.6 GB/s), Intel Hyper-Threading Technology, 200 MHz Intel HD Graphics GPU (max. 1 GHz), Intel Smart Connect Technology, Intel Wireless Display, Intel Virtualization Technology (VT-x), eDP/DP/HDMI, Intel Quick Sync Video, Intel Clear Video Technology, Intel HD Audio Technology, Intel Rapid Storage Technology |
Datasheet Attributes:
|
Data Integrity |
Final |
Added![The exact time of the datasheet addition The exact time of the datasheet addition](icons/10x10/info_gray.gif) |
2014-08-15 17:47 |