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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Qualcomm
Type Snapdragon 820 APQ8096
Year Released 2015
FunctionMain function of the component  Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) ARMv8-A (A32, A64)
Type of processor core(s)Type and allocation of processor core(s) 4x Qualcomm Kryo
Number of processor core(s) quad-core

BusesBuses: 
Memory Interface(s):   LPDDR4 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 1866 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 32 bit
Number of data bus channels 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 29.86 Gbyte/s
Non-volatile Memory Data Bus WidthMaximum selectable bit width of secondary data (non-volatile storage) bus of memory interface 16 bit
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  eMMC 5.1


Clock FrequenciesClock Frequencies: 
Recommended Minimum Clock Frequency 1593 MHz min.
Recommended Maximum Clock Frequency 2150 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 32 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 1536 Kbyte L2

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 14 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component TSMC

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Qualcomm Adreno 530 GPU
GPU Clock 624 MHz GPU
Dedicated Graphics MemoryDedicated operative memory (video RAM, VRAM) 1 MiB

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  No

Additional InformationAdditional Information: 
Special Features
dual Qualcomm Kryo Harvard Superscalar cores (up to 2.15 GHz) + dual Qualcomm Kryo Harvard Superscalar cores (up to 1.59 GHz), HMP, Hexagon 680 DSP, 2160p 60 fps video decode, 2160p 30 fps video encode, Qualcomm IZat GPS+Glonass, Bluetooth 4.1,.. ››

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2017-02-27 20:23
 
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