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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Intel
Type Celeron N3350
Codename Apollo Lake
Year Released 2016
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) IA-64 (x86-64), MMX, SSE, SSE2, SSE3, SSE4, SSE4.1, SSE 4.2
Type of processor core(s)Type and allocation of processor core(s) 2x Intel Goldmont
Number of processor core(s) dual-core

BusesBuses: 
Memory Interface(s):   DDR3L SDRAM , LPDDR3 SDRAM , LPDDR4 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 1200 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 64 bit
Number of data bus channels 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 38.4 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  Yes


Clock FrequenciesClock Frequencies: 
Internal Systembus Clock 1100 MHz
Recommended Maximum Clock Frequency 2400 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 24 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 2048 Kbyte L2

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 14 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component Intel
PinsNumber of pins on the package 1296 pins

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Intel HD Graphics 500 GPU
Number of GPU cores 12-core GPU
GPU Clock 200 MHz GPU

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  No

Additional InformationAdditional Information: 
Special Features
2.4 GHz (Burst Frequency) dual Intel Goldmont processor cores, 8-way 32 Kbyte instruction cache per core, 6-way 24 Kbyte data cache per core, 1024 Kbyte L2 Cache per core, dual-channel 64-bit 933 MHz DDR3L-1866 / 933 MHz LPDDR3-1866 / 1200.. ››

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2017-03-15 12:44
 
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