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Processor Specs: Referred (not editable) comparison sheet [2]

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Qualcomm Snapdragon 820 MSM8996
Qualcomm Snapdragon 820 APQ8096
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Qualcomm Snapdragon 820 MSM8996
Qualcomm Snapdragon 820 APQ8096
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Generel CharacteristicsGenerel Characteristics
Year Released 2015 2015
FunctionMain function of the component Multi-core Application Processor with Modem Application Processor

ArchitectureArchitecture
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit 64 bit
Supported Instruction Set(s) ARMv8-A (A32, A64) ARMv8-A (A32, A64)
Type of processor core(s)Type and allocation of processor core(s) 4x Qualcomm Kryo 4x Qualcomm Kryo
Number of processor core(s) quad-core quad-core

BusesBuses
Memory Interface(s) LPDDR4 SDRAM LPDDR4 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 1866 MHz 1866 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 32 bit 32 bit
Number of data bus channels 2 ch 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 29.86 Gbyte/s 29.86 Gbyte/s
Non-volatile Memory Data Bus WidthMaximum selectable bit width of secondary data (non-volatile storage) bus of memory interface 16 bit 16 bit
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory eMMC 5.1, UFS 2.0 eMMC 5.1

Clock FrequenciesClock Frequencies
Recommended Minimum Clock Frequency 1593 MHz min. 1593 MHz min.
Recommended Maximum Clock Frequency 2150 MHz max. 2150 MHz max.

Cache MemoriesCache Memories
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 32 Kbyte D-Cache 32 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 1536 Kbyte L2 1536 Kbyte L2



Technology and PackagingTechnology and Packaging
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 14 nm 14 nm
Semiconductor Technology CMOS CMOS
FabPlant which fabricates the semiconductor component TSMC TSMC

Graphical SubsystemGraphical Subsystem
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Qualcomm Adreno 530 GPU Qualcomm Adreno 530 GPU
GPU Clock 624 MHz GPU 624 MHz GPU
Dedicated Graphics MemoryDedicated operative memory (video RAM, VRAM) 1 MiB 1 MiB

Cellular CommunicationCellular Communication
Supported Cellular Data LinksList of supported cellular data links CSD, GPRS, EDGE, UMTS, HSUPA, HSUPA 5.8, HSUPA 11.5, HSDPA, HSPA+ 21.1, DC-HSDPA 42.2, cdmaOne, CDMA2000 1x, CDMA2000 1xEV-DO, CDMA2000 1xEV-DO Rev A, CDMA2000 1xEV-DO Rev B, TD-SCDMA, LTE, LTE 100/50, LTE 150/50, LTE 300/50, LTE 450/100 data links No

Additional InformationAdditional Information
Special Features dual Qualcomm Kryo Harvard Superscalar cores (up to 2.15 GHz) + dual Qualcomm Kryo Harvard Superscalar cores (up to 1.59 GHz), HMP, Hexagon 680 DSP, Qualcomm X12 LTE Modem, CDMA 2000 1x Adv./DO Rel 0., Rev. A/B, SVDO-DB, GSM, GPRS,.. dual Qualcomm Kryo Harvard Superscalar cores (up to 2.15 GHz) + dual Qualcomm Kryo Harvard Superscalar cores (up to 1.59 GHz), HMP, Hexagon 680 DSP, 2160p 60 fps video decode, 2160p 30 fps video encode, Qualcomm IZat GPS+Glonass, Bluetooth 4.1,..

Datasheet AttributesDatasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Preliminary Preliminary
AddedThe exact time of the datasheet addition 2015-06-29 10:53 2017-02-27 20:23

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