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Processor Specs: Referred (not editable) comparison sheet [2]

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Intel Core 6th Gen i5-6300U (Skylake)
Intel Core 6th Gen i3-6006U (Skylake)
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Intel Core 6th Gen i5-6300U  (Skylake)
Intel Core 6th Gen i3-6006U  (Skylake)
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Generel CharacteristicsGenerel Characteristics
Year Released 2015 2016
FunctionMain function of the component Multi-core Application Processor Multi-core Application Processor

ArchitectureArchitecture
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit 64 bit
Supported Instruction Set(s) IA-64 (x86-64), MMX, SSE, SSE2, SSE3, SSE4, SSE 4.1, SSE 4.2 IA-64 (x86-64), MMX, SSE, SSE2, SSE3, SSE4, SSE 4.1, SSE 4.2
Type of processor core(s)Type and allocation of processor core(s) 2x Intel Skylake-U 2x Intel Skylake-U
Number of processor core(s) dual-core dual-core

BusesBuses
Memory Interface(s) DDR3L SDRAM, LPDDR3 SDRAM DDR3L SDRAM, LPDDR3 SDRAM
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 64 bit 64 bit
Number of data bus channels 2 ch 2 ch
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory Yes Yes

Clock FrequenciesClock Frequencies
Recommended Minimum Clock Frequency 2400 MHz min.
Recommended Maximum Clock Frequency 3000 MHz max. 2000 MHz max.

Cache MemoriesCache Memories
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 32 Kbyte D-Cache 32 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 512 Kbyte L2 512 Kbyte L2
Total L3 Cache 3072 Kbyte L3



Technology and PackagingTechnology and Packaging
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 14 nm 14 nm
Semiconductor Technology CMOS CMOS
FabPlant which fabricates the semiconductor component Intel Intel
PinsNumber of pins on the package 1356 pins 1356 pins

Graphical SubsystemGraphical Subsystem
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Intel Iris Graphics 520 GPU Intel Iris Graphics 520 GPU
GPU Clock 300 MHz GPU 300 MHz GPU

Cellular CommunicationCellular Communication

Additional InformationAdditional Information
Special Features Dual Intel Core i5 Skylake-U processor cores, 32 Kbyte instruction cache per core, 32 Kbyte data cache per core, 256 Kbyte L2 cache per core, 3 Mbyte L3 cache (Intel Smart Cache), dual-channel 64-bit DDR4-2133, LPDDR3-1866, DDR3L-1600 SD RAM interface.. Dual Intel Core i5 Skylake-U processor cores, 32 Kbyte instruction cache per core, 32 Kbyte data cache per core, 256 Kbyte L2 cache per core, 3 Mbyte L3 cache (Intel Smart Cache), dual-channel 64-bit DDR4-2133, LPDDR3-1866, DDR3L-1600 SD RAM interface..

Datasheet AttributesDatasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Preliminary Preliminary
AddedThe exact time of the datasheet addition 2015-10-08 14:28 2016-12-06 23:10

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