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IntroductionIntroduction: 
BrandBrand name of the device. This may match with the manufacturer Samsung
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated SM-F700W/DS Galaxy Z Flip TD-LTE CA 256GB
BriefBrief Introduction: One or two sentences which enumerates some important attributes of the specifc device variant described by this datasheet
Galaxy Z Flip 4G for Canada with a 6.7-inch FHD+ foldable Infinity Flex Display, 256 GB UFS 3.1 ROM, dual OIS 12 + 12 MP rear camera setup and wireless charging capability
ReleasedFirst official market release date in (year, month) 2020 Feb
AnnouncedDate of the official announcement (year, month) 2020 Feb 11
Hardware DesignerThe company which designed this device Samsung Electronics
ManufacturerThe company which produces this device Samsung Electronics
CodenameThe codename internally identified the design project of this product. Model variants of the same model are identified and linked to each other via the same Codename Samsung Bloom
OEM IDThe OEM ID is internal code and refers to a specific variant of the model series F700WZKDXAC
General ExtrasHardware extras like stylus, kickstand, rotatatble screen, rotatable keyboard, haptic feedback, etc.  Haptic touch feedbackHaptic (inlcuding kinesthetic) touch device applies forces and vibrations to give feedback to the user when tapping the touchscreen , Foldable screen
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  SmartphoneCallular voice-capable usually touchscreen mobile computer which natively runs third-party apps.
List of Additional FeaturesComma separated list of low priority special features which are not included in other fields
dimension when folded: 87.4 x 73.6 x 17.3 mm, 720p 960 fps, 1080p 240 fps video recording

Physical AttributesPhysical Attributes: 
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 73.6 mm
2.9 inchWidth measured in inches
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 167.3 mm
6.59 inchHeight measured in inches
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 7.2 mm
0.28 inchesDepth measured in inches
Typical depthThis thickness value can be measured at the most points of the device 6.9 mm
Bounding VolumeThe volume of the smallest cuboid which can bound the device in cubecentimetres 88.7 ccm
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 183 g
6.46 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Google Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 10 (Q)Google Android 10 (Q)
One UI 2.1Subversion, update version, user interface, defualt language, etc.
Software ExtrasNavigation software, voice recognition, face recognition, personal assistant app, etc.  Voice Command , Business card recognitionThis feature allows the device to scan and recognize (OCR) a physical businass card with the built-in camera and a business card recognizer software. , Navigation softwarepre-installed , Augmented Reality (AR) , Virtual Reality (VR) support , Intelligent personal assistantLearning personal assistant based on artificial intelligence (AI) , Voice RecognitionUser identification by voice , Face RecognitionFace identification by built-in camera

Application processor, ChipsetApplication processor, Chipset: 
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 2956 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Qualcomm Snapdragon 855+ SM8150-AC (Hana), 2019, 64 bit, octa-core, 64 Kbyte I-Cache, 64 Kbyte D-Cache, 1792 Kbyte L2, 2048 Kbyte L3, 7 nm, Qualcomm Adreno 640 GPUQualcomm Snapdragon 855+ SM8150-AC (Hana), 2019, 64 bit, octa-core, 64 Kbyte I-Cache, 64 Kbyte D-Cache, 1792 Kbyte L2, 2048 Kbyte L3, 7 nm, Qualcomm Adreno 640 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  LPDDR4x SDRAM
2133 MHzClock frequency of the RAM databus (not necessarily equivalent to data transfer frequency). The width of the databus (e.g. 64 bit), RAM type (e.g. DDR SDRAM), number of channels and clock rate (e.g. 200 MHz) determines peak transfer rate
RAM CapacityCapacity of the random access memory in mebibytes (binary megabytes) 8192 MiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance  Flash EEPROM
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory  UFS 3.1UFS 3.1 (released as JESD220E in 2020) defines single-lane 1.45 GB/s or dual-lane 2.9 GB/s NAND flash EEPROM interface
Non-volatile Memory CapacityNon-volatile memory in mebibytes (binary megabytes).2GB = 1907.3MiB, 4GB = 3814.7MiB, 8GB = 7629.4MiB, 16GB = 15258.8MiB, 32GB = 30517.6MiB, 64GB = 61035.2MiB, 128GB = 122070.3MiB, 256GB = 244140.6MiB, 512GB = 488281.3MiB, 1TB = 953674MiB, 2TB = 1907349Mi 244140 MiB non-volatile
226300 MiB free user storageUser-accessible partition of non-volatile storage space
Secondary Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance  Flash EEPROM

DisplayDisplayAll parameters that related to display
Display HoleNumber of in-display camera or sensor holes 1-hole
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 170.1 mm
6.7 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 1080x2636
2846880 pixelsThe total number of pixels is the product of horizontal and vertical number of pixels
Display WidthThe distance between the vertical edges of the display (horizontal display size). In case of display with rounded edges this refers to the smallest bounding rectangle. 64.49 mm
2.54 inchDisplay width in inches
Display HeightThe distance between the horizontal edges of the display (vertical Display Size). In case of display with rounded edges this refers to the smallest bounding rectangle. 157.4 mm
6.2 inchDisplay height in inches
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 9.11 mm
Display AreaCalculated display area is the product of max. horizontal and vertical display sizes. In case of display with rounded edges or notch this refers to the smallest display bounding rectangle. 10150.7 square millimeter
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 82.4%
Pixel SizeCalculated pixel size based on display diagonal, resolution and aspect ratio 0.05971 mm/pixel
Pixel DensityIndicates the number of pixels per inch 425 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  Color AM-OLEDColor AM-OLED (Active Matrix - Organic Light-emitting Diode) display techology. display
Display SubtypeBrand name of the subtype/technology of the screen like Super AMOLED, SLCD2/3/5, Retina Display, Reality Display, ClearBlack, etc.  Dynamic AM-OLEDDynamic AM-OLED is an improved type of Super AM-OLED display technology developed by Samsung with dynamic tone mapping for HDR10+ support
Display Color DepthColor depth defines how many colors or greyscales can be displayed 24 bit/pixel
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Display Dynamic Range DepthBit depth of the dynamic range defines the luminance ratio between the brightest and the darkest state of a pixel (HDR10: 10 bit, HDR10+: 12 bit) 8 bit/pixel
Display IlluminationForm of illumination used for lighting or backlighting LCD display in dark and dim ambient condtions.  Self-illuminatingOLED-based display technologies do not require illumination because they are built up from organic light-emitting diodes.
Display Light Reflection ModeThe ratio between reflected and transmitted light depends on reflection mode thus display technology. Possible options: transflective, reflective, transmissive, etc.  Yes
Display Subpixel SchemeSpecifies how and how many subpixels are pixels consists of. Usual schemes: RGB, RGBG, RGBW, PenTile, Diamond Pixel  Yes
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  No
Display ModuleManufacturer part number of the display module Samsung
Secondary Display Diagonal:  26.8 mm
1.1 inch
Secondary Display ResolutionIn case of open-out or double-sided devices. Secondary display has the same or weaker characteristics than the primary display. 300x112
Secondary Number of pixels:  33600 pixels
Secondary Horizontal Display Size:  25.11 mm
Secondary Horizontal Display Size :  0.99 inch
Secondary Vertical Display Size:  9.37 mm
Secondary Vertical Display Size:  0.37 inches
Secondary Display Area:  235.3 square millimeter
Secondary Display Pixel Size:  0.08369 mm/pixel
Secondary Display Pixel Density (dot pitch):  303 PPI
Secondary Display Type:   Color AM-OLEDColor AM-OLED (Active Matrix - Organic Light-emitting Diode) display techology. 2nd display
Secondary Display Subtype:   Super AM-OLEDSuper AM-OLED is an improved type of AM-OLED display technology developed by Samsung where touch-sensitve layer is integrated into the screen. Super AM-OLED uses Samsung PenTile matrix RGBG subpixel arrangement (2 subpixels)
Secondary Display Color Depth:  24 bit/pixel
Secondary Number of Display Colors/Scales:  16.8M
Secondary Display Dyn. Range Depth:  8 bit/pixel
Secondary Display Illumination:   Self-illuminatingOLED-based display technologies do not require illumination because they are built up from organic light-emitting diodes.
Secondary Display Light Reflection Mode:   Yes
Secondary Display Subpixel Scheme:   Yes
Scratch Resistant Sec. Screen:   Yes
Secondary Display ModuleManufacturer part number of the sec. display module Samsung

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset Qualcomm Adreno 640
Dedicated Graphics MemoryDedicated operative memory (video RAM, VRAM) of graphics controller or GPU which independent from the op. memory of the main processor. Graphics controller may have access to the main RAM (shared RAM) too 1 MiB
GPU Clock:  672 MHz

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  DisplayPort (Unspecified)
USB Type-C reversiblePhysical interface of the A/V out port. For example: HDMI D, USB-C, micro-USB or DB25
A/V Out Max. ResolutionThe largest resolution supported by video out  3840x2160 (2160p) 4K UHD

Audio SubsystemAudio Subsystem: 
Audio Channel(s)Number of independent channels supported by the audio subsystem of the device, e.g.: mono, stereo, 5.1, 7.1, etc.  stereo

Sound Recording: 
A/D Converter Nominal ResolutionThe resulution (Q) of the analog/digital converter which converts the analog voltage signal of the built-in microphone or microphone input to a series of Q-wide binary samples 32 bit quantization
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  stereo

Sound Playing: 
D/A Converter Nominal ResolutionThe resulution (R) of the digital/analog converter which converts a series of R-wide binary samples to the analog voltage signal of the built-in speaker or audio out 32 bit quantization
D/A Holding FrequencyThe maximum holding frequency of the digital/analog converter 384000 Hz
Loudspeaker(s):   mono
Audio Output:   USB Type-C

Cellular PhoneCellular Phone: 
Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  GSM 850MHz (B5)GSM850 phones support GSM 850 MHz (B5) band (downlink: 869.2 MHz - 894.2 MHz, uplink: 824.2 MHz - 849.2 MHz) , GSM 900MHz (B8)GSM900 phones support P-GSM (Primary GSM) 900 MHz (B8) band (downlink: 935.0 MHz - 960.0 MHz, uplink: 890.0 MHz - 915.0 MHz) and may support E-GSM (Extended GSM) 900 MHz band (downlink: 925.0 MHz - 960.0 MHz, uplink: 880.0 MHz- 915.0 MHz. , GSM 1800MHz (B3)GSM1800 phones support GSM / DCS / PCS 1800 MHz (B3) band (downlink: 1805.2 - 1879.8 MHz, uplink: 1710.2 - 1784.8 MHz). , GSM 1900MHz (PCS, B2)GSM1900 phones support PCS 1900 MHz (B2) band (downlink: 1930.2 - 1989.8 MHz, uplink: 1850.2 - 1909.8 MHz) , UMTS 2100MHz (Band I, IMT)UMTS2100 phones support UMTS 1900 / 2100MHz (IMT, also refferred as UMTS Band I) band (downlink: 2112.4 - 2167.6 MHz, uplink: 1922.4-1977.6 MHz) , UMTS 1900MHz (Band II, PCS)UMTS1900 phones support UMTS 1900MHz (PCS, also refferred as UMTS Band II) band (downlink: 1932.4 - 1987.6 MHz, uplink: 1852.4-1907.6 MHz) , UMTS 1700/2100MHz (Band IV, AWS)UMTS1700/2100 phones support UMTS 1700 / 2100 MHz (AWS, also refferred as UMTS Band IV) band (downlink: 2112.4 - 2152.6 MHz, uplink: 1712.4-1752.6 MHz) , UMTS 850MHz (Band V, CLR)UMTS850 phones support UMTS 850 MHz (CLR, also refferred as UMTS Band V) band (downlink: 871.4 - 891.6 MHz, uplink: 826.4 - 846.6 MHz) , UMTS 900MHz (Band VIII)UMTS900 phones support UMTS 900 MHz (UMTS Band VIII) band (downlink: 927.4 - 957.6 MHz, uplink: 882.4-912.6 MHz) , CDMA 800MHz (BC0, 850)CDMA800 phones support CDMA 800 MHz (CDMA Band Class 0, also known as CDMA850) band (downlink: 860 MHz - 894 MHz, uplink: 815 MHz - 849 MHz). , LTE 2100 MHz (Band 1)LTE2100 phones support LTE 1900 / 2100MHz (IMT, also refferred as LTE Band 1) band (downlink: 2110 - 2170 MHz, uplink: 1920 - 1980 MHz) , LTE 1900 MHz (Band 2, PCS)LTE1900 phones support LTE 1900 MHz (PCS , also referred as LTE Band 2) band (downlink: 1930 - 1990 MHz, uplink: 1850 - 1910 MHz) , LTE 1800 MHz (Band 3)LTE1800 phones support LTE 1800 MHz (LTE Band 3) band (downlink: 1805 - 1880 MHz, uplink: 1710 - 1785 MHz) , LTE 1700/2100 MHz (Band 4, AWS)LTE1700/2100 phones support LTE 1700 / 2100 MHz (AWS also referred as LTE Band 4) band (downlink: 2110 - 2155 MHz, uplink: 1710 - 1755 MHz) , LTE 850 MHz (Band 5)LTE850 phones support LTE 850 MHz (LTE Band 5) band (downlink: 869 - 894 MHz, uplink: 824 - 849 MHz) , LTE 2600 MHz (Band 7)LTE2600 phones support LTE 2600 MHz (LTE Band 7) band (downlink: 2620 - 2690 MHz, uplink: 2500 - 2570 MHz) , LTE 900 MHz (Band 8)LTE900 phones support LTE 900 MHz (LTE Band 8) band (downlink: 925 - 960 MHz, uplink: 880 - 915 MHz) , LTE 700 MHz (Band 12)LTE700 phones support LTE 700 MHz (LTE Band 12) band (downlink: 728 - 746 MHz, uplink: 698 - 716 MHz) , LTE 700 MHz (Band 13)LTE700 phones support LTE 700 MHz (LTE Band 13) band (downlink: 746 - 756 MHz, uplink: 777 - 787 MHz) , LTE 800 MHz (Band 18)LTE800 phones support LTE 800 MHz (LTE Band 18) band (downlink: 860 - 875 MHz, uplink: 815 - 830 MHz) , LTE 800 MHz (Band 19)LTE800 phones support LTE 800 MHz (LTE Band 19) band (downlink: 875 - 890 MHz, uplink: 830 - 845 MHz) , LTE 800 MHz (Band 20)LTE800 phones support LTE 800 MHz (LTE Band 20) band (downlink: 791 - 821 MHz, uplink: 832 - 862 MHz) , LTE 1900 MHz (Band 25)LTE1900 phones support LTE 1900 MHz (LTE Band 25) band (downlink: 1930 - 1995 MHz, uplink: 1850 - 1915 MHz) , LTE 700 MHz (Band 29)LTE Band 29 band (downlink: 716 - 728 MHz) is for carrier aggregation , LTE 2300 MHz (Band 30)LTE Band 30 band (downlink: 2350 - 2360 MHz, uplink: 2305 - 2315 MHz) , TD-LTE 2600 MHz (Band 38)TD-LTE 2600 MHz phones support TD-LTE 2600 MHz (LTE Band 38) band (2570 - 2620 MHz) , TD-LTE 1900 MHz (Band 39)TD-LTE 1900 MHz phones support Chinese TD-LTE 1900 MHz (LTE Band 39) band (1880 - 1920 MHz) , TD-LTE 2300 MHz (Band XL)TD-LTE 2300 phones support Chinese TD-LTE 2300 MHz (LTE Band 40) band (2300 - 2400 MHz) , TD-LTE 2500 MHz (Band XLI)TD-LTE 2500 MHz phones support TD-LTE 2500 MHz (LTE Band 41) band (2496 - 2690 MHz) , LTE 1700/2100 MHz (Band 66)LTE Band 66 (AWS-3) band (downlink band: 2110 - 2200 MHz, uplink band: 1710 - 1780 MHz) , LTE 600 MHz (Band 71)LTE600 phones support T-Mobile USA LTE 600 MHz (LTE Band 71) band (downlink: 617 - 652 MHz, uplink: 663 - 698 MHz) bands
Supported Cellular Data LinksList of supported cellular data links and rates.  GPRS (Class unspecified)General Packet Radio Service , GPRS Class 12 , GPRS Multi-slot Class 33 , EDGE (Class unspecified)Enhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS) , EDGE Multi-slot Class 12 , EDGE Multi-slot Class 33 , UMTS 384 kbps (W-CDMA)Universal Mobile Telecommunications System. UMTS Release '99 data link layer, W-CDMA grants up to 384 kbit/s pocket-switched download speed. , HSUPA (Cat. unspecified)High-Speed Uplink Packet Access is a 3.5G UMTS uplink protocol. , HSUPA 5.76 Mbps (Cat. 6) , HSDPA (Cat. unspecified)High-Speed Downlink Packet Access is a 3.5G UMTS downlink protocol. , HSPA+ 21.1 Mbps (Cat. 18) , DC-HSDPA 42.2 Mbps (Cat. 24)Dual-carrier HSPA+ 42.2 Mbps , cdmaOne (IS-95) , CDMA2000 1xRTT (IS-2000) , CDMA2000 1xEV-DO Rel. 0 , CDMA2000 1xEV-DO Revision A , LTE (Cat. unspecified)LTE (Long Term Evolution) or the E-UTRAN (Evolved Universal Terrestrial Access Network), introduced in 3GPP R8, is the 4G access part of the Evolved Packet System (EPS). , LTE 100 Mbps / 50 Mbps (Cat. 3)LTE 100.8 Mbps / 50.4 Mbps (Cat. 3) , LTE 150 Mbps / 50 Mbps (Cat. 4)LTE 151.2 Mbps / 50.4 Mbps (Cat. 4) , LTE 300 Mbps / 50 Mbps (Cat. 6)More exact values: LTE 301.5 Mbps / 50.4 Mbps (Cat. 6) , LTE 300 Mbps / 100 Mbps (Cat. 7)More exact values: LTE 301.5 Mbps / 100.8 Mbps (Cat. 7) , LTE 400 Mbps / 150 Mbps (LTE Cat. 13)LTE Category 13: 391.7 Mbps downlink, 150.8 Mbps uplink (rel. 12) , LTE 1 Gbps / 100 Mbps (LTE Cat. 16)LTE Category 16: 979 Mbps downlink, 5 CA, 105 Mbps uplink data links
SIM Card SlotSupported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc.  e-SIM (embedded) , Nano-SIM (4FF)
Cellular AntennaPhysical antenna layout. Most common type: internal. Historic types: fixed external, pull-out, open-out  Internal antenna
Call Alert SoundPolyphonic or monophonic call alert sound (number of chords) 128-chord melody
Hearing Aid Compatibility (HAC)Hearing Aid Compatibility (HAC) rate, For example: M3/T4  Yes
Complementary Phone ServicesPossible extras: voice transmission, voice speaker, vibration, speakerphone, active noise cancellation, PTT, HD Voice, VoLTE, etc.  Voice transmissionDevice is able to receive and transmit voice over cellular network , Voice speakerDedicated voice speaker is located near to the ear when talking and optimized for the spectrum and peak-to-peak range of the human voice. , Vibrating Alert , Speakerphone , ANCActive noise cancellation (ANC) , HD Voice , Voice over LTE (VoLTE) , Video over LTE (ViLTE)
Cellular ControllerManufacturer part number of the cellular modem and controller IC or commercial name of the intellectual property (IP) if the function is the part of a chipset Qualcomm SM8150

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch sensing screen
Touchscreen Simultaneous Touch PointsDetermines how many touches the touch-sensitive screen module is able to simultaneously detect at most  10-point


Communication InterfacesCommunication Interfaces: 
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  No
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB Hi-Speed (480 Mbps) , USB SuperSpeed (5 Gbps)Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB chargingThe device is able to charge its battery supplied from the USB port. , USB fast chargingFast charging is supported , USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc. , USB On-The-Go 1.3 , USB On-The-Go 2.0 , USB Power DeliveryDevice which meets USB Battery Charging Specification Revision 1.1 / 1.2 is able to supply current from 500 mA to 1.5 A for the client device at 5V. , USB Power Delivery 2.0Device which meets USB Power Delivery 2.0 is able to supply current from 3 A to 5 A for the client device at 20V.
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  USB Type-C reversible
Max. Charging PowerMultiplication of maximal charging current and maximal battery voltage during battery recharging 15.0 W
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Bluetooth 5.0Released in Dec, 2016
Internal antenna
Bluetooth profilesList of supported Bluetooth profiles e.g. aptX, A2DP, AVRCP, HSP, HID, PBA, PAN, OPP, MAP  A2DPAdvanced Audio Distribution Profile , A2DP with aptX codecAdvanced Audio Distribution Profile with aptX codec , A2DP with aptX HD codecAdvanced Audio Distribution Profile with aptX High Definition codec , AVRCPAudio/Video Remote Control Profile (AVRCP) , DIPDevice ID Profile (DIP) , GAVDPGeneric Audio/Video Distribution Profile (GAVDP) , HFPHands-Free Profile (HFP) , HIDHuman Interface Device Profile (HID) , HSPHeadset Profile (HSP) , MAPMessage Access Profile (MAP) , OPPObject Push Profile (OPP) , PANPersonal Area Networking Profile (PAN) , PBAPhone Book Access Profile (PBA)
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  IEEE 802.11aShort range standard, 5 GHz, max. 54 Mbit/s , IEEE 802.11b2.4 GHz (ISM band), max. 11 Mbit/s , IEEE 802.11g2.4 GHz (ISM band), max. 54 Mbit/s , IEEE 802.11n2.4 GHz (ISM band) or optional 5 GHz support, max. 600 Mbit/s thanks to MIMO antennas , IEEE 802.11ac2.4 GHz (ISM band) or optional 5 GHz support (4915...5825 MHz), max. 1300 Mbit/s thanks to MIMO antennas
Internal antenna
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.  DLNADLNA (Digital Living Network Alliance) over Wireless LAN , MiracastMiracast screensharing standard uses Wi-Fi Direct connection , Wi-Fi Direct , Wi-Fi TetheringWi-Fi Mobile Hotsport , Wi-Fi Calling (VoWiFi)Voice over WiFi (VoWiFi)
NFCNear Field Communication is short-range wireless radio data exchange technology based on radio-frequency identification (RFID). This field enumerates the supported NFC technologies.  NFC AISO/IEC 14443 Type A , NFC BISO/IEC 14443 Type B

Multimedia BroadcastMultimedia Broadcast: 
FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  No

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s)Possible protocols: NMEA 0183, SIRF, etc.  GPS (NMEA 0183)NMEA 0183
Satellite Antenna:   Internal antenna
Complementary Satellite ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Simultaneous GPS (S-GPS) , Assisted GPS , Geotagging , QuickGPS , QZSSQuasi-Zenith Satellite System
Supported GLONASS protocol(s)GLONASS is a global satellite navigation system operated by Russia.  L1OFGLONASS L1OF FDMA signal centered at 1602 MHz, features a BPSK(0.5) modulation.
Supported Galileo service(s)Galileo is a global satellite navigation system operated by European Union and the European Space Agency.  E1Galileo E1 band centered at 1575.42 MHz and with a reference bandwidth of 24.552 MHz, uses the Composite Binary Offset Carrier (CBOC) modulation
Supported BeiDou system (BDS)BeiDou System (BDS) is a Chinese satellite navigation system. Its global variant is the BeiDou-2 alias COMPASS.  B1IBeiDou-2 (COMPASS) B1I signal transmitted by BDS-2 satellites is centered at 1561.098 MHz, featuring a QPSK(2) modulation BeiDou receiver
Navigation ControllerManufacturer part number of the GNSS (GPS, GLONASS, Galileo and/or BDS) controller IC or commercial name of the intellectual property (IP) if the controller is the part of a chipset Qualcomm SM8150

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any
Camera PlacementRefers to the placement of the primary camera on the device. Front, rear or rotatable. Generally rear.  Rear
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
Image Sensor FormatThe format of the image sensor determines the physical dimensions of the image sensor 1/2.55
Image Sensor Pixel SizePixel size of the primary camera sensor 1.40 micrometer
Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the camera can take a picture 4032x3024 pixel
Number of effective pixelsA measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 12.2 MP camera
Aperture (W)Wide-angle aperture of lens or aperture of lens in case of camera without optical zoom f/1.80
ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1.0 x optical zoom
8.0 x digital zoomDigital zoom is an image signal processing method which cuts out and enlarges a desired part of the captured image while losing the rest of the image
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  Phase-Detection Autofocus (PD AF)Phase-detection (PD) is a passive autofocus system which measures the phase difference between a two images to reach correct focus.
Min. Equiv. Focal LengthMinimum focal length (35 mm equivalent) of lens or fixed focal length (35 mm equivalent) in case of lens without optical zoom. 26 mm
Recordable Image FormatsSupported file formats while capturing photos by primary camera  JPG
Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the primary camera can capture video 3840x2160 pixel
60 fpsRecording frame rate when recording video at maximum resolution
Recordable Video FormatsSupported file formats while capturing videos  HEVCHigh Efficiency Video Coding (HEVC) with H.265 codec (MPEG-H Part 2) , MPEG4
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  single LEDAlso known as mobile light
Camera Extra FunctionsPopular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch  Optical Image Stabilization (OIS)OIS (also know as IS, OS, VR, AS) utilizies precision electromechanic actuators in the lens which modifies the optical path to the image sensor to compensate the motion of the camera. , Video Stabilizer (OIS) , Pixel unificationThis method reduces image noise in low light conditions by merging 4 sensor pixels to 1 pixel (or 9 sensor pixels to 1) at the cost of quartering (or 1/9) the resolution. Also known as 4-in-1 pixel (or 9-in-1) fusion or super pixel mode , HDR photoHigh dynamic range image recording , HDR videoHigh-dynamic-range video recording , Red-eye effect reduction , Slow motion videoSlowmo cameras are able to achieve at least 100 frame per second frame rate. , Burst mode , RefocusRefocus function allows you take a photo first and decide what you want to see in focus later. , Touch focus , Macro modeAn autofocus feature that allows for close-up photographs to be taken with the onboard digital camera , Panorama Photo , Face detection , Face tagging , Smile detection , Face retouch , Face retouch (video) , Intelligent scene detection

Auxiliary Camera: 
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
Aux. Cam. Image Sensor Pixel SizePixel size of the aux. camera sensor 1.12 micrometer
Aux. Camera Number of Pixels Number of effective pixels of Auxiliary Camera (2nd camera of primary camera system) in at least dual lens camera setup 12.0 MP aux. cam
Aux. Camera Aperture (W)Wide-angle aperture of aux. lens or aperture of aux. lens in case of aux. camera without optical zoom f/2.20
Aux. Cam. Min. Equiv. Focal LengthMinimum focal length (35 mm equivalent) of aux. lens or fixed focal length (35 mm equivalent) in case of aux. lens without optical zoom. 13 mm
Aux. Camera Extra FunctionsPopular extra features of the aux. camera: OIS, EIS, HDR photo  Optical Image Stabilization (OIS)OIS (also know as IS, OS, VR, AS) utilizies precision electromechanic actuators in the lens which modifies the optical path to the image sensor to compensate the motion of the camera. , Video Stabilizer (OIS) , HDR photoHigh dynamic range image recording , HDR videoHigh-dynamic-range video recording , Burst mode , Touch focus , Panorama Photo , Intelligent scene detection

Auxiliary Camera No. 2: 
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No

Auxiliary Camera No. 3: 
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No

Auxiliary Camera No. 4: 
Aux. 4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No
Aux. 4 Camera FocusFocusing method of the fourth auxiliary camera  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies
Secondary Camera PlacementRefers to the placement of the secondary camera on the device. Front or rear. Generally front camera for selfies or video call.  Front
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  BSI CMOSBackside Illuminated CMOS (Complementary MOS circuit)
Secondary Image Sensor Pixel SizePixel size of the secondary camera image sensor 1.22 micrometer
Secondary Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can take a picture 3648x2736 pixel
Secondary Camera Number of pixelsA measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 10.0 MP sec. cam
Secondary Aperture (W)Wide-angle aperture of lens or aperture of lens in case of secondary camera without optical zoom f/2.40
Secondary Camera FocusFocus methods of secondary camera  Phase-Detection Autofocus (PD AF)Phase-detection (PD) is a passive autofocus system which measures the phase difference between a two images to reach correct focus.
Secondary Recordable Image FormatsSupported file formats while capturing photos by secondary camera  JPG
Secondary Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can capture video 1920x1080 pixel
Secondary Recordable Video FormatsSupported file formats while capturing videos by the secondary camera  3GP , 3G2 , HEVCHigh Efficiency Video Coding (HEVC) with H.265 codec (MPEG-H Part 2)
Secondary Camera Extra FunctionsPopular extra features of the secondary camera: Face detection, HDR photo, Selfie Panorama, Smile detection, Face Retouch / Face Beautification  HDR photoHigh dynamic range image recording , HDR videoHigh-dynamic-range video recording , Slow motion videoSlowmo cameras are able to achieve at least 100 frame per second frame rate. , Burst mode , Touch focus , Panorama Photo , Face detection , Face tagging , Smile detection , Face retouch , Face retouch (video) , Intelligent scene detection

Secondary Auxiliary Camera: 
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  No

Secondary Auxiliary Camera No. 2: 
Sec. Aux. 2 Cam. Image SensorImage sensor technology of sec. auxiliary 2 camera in at least triple lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 
Built-in compassBuilt-in electroinc compass types: 1D, 2D, 3D  3D (3-axis) compass
Built-in accelerometerAn internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis. Possible types: 1D, 2D, 3D  3D (3-axis) accelerometer
Built-in gyroscopeAn internal component that senses the orientation of the device. Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D  3D (3-axis) gyro
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  Barometer , Fingerprint sensorDevice is able to identify the user by using a built-in dedicated biometric fingerprint recogniser sensor placed at the front, rear or any side of the device , Hall sensor , Light intensity sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen , Proximity sensorBased on this sensor signal device may control the volume of the voice speaker or dim the display during a call

Ingress ProtectionIngress Protection: 
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  Yes

Power SupplyPower Supply: 
BatteryBattery technology  Lithium-ion polymer (LiPo)
built-inPossible options: removable, built-in
Battery Cells in ParallelIf this field is true the cells of the battery are in parallel connection while discharging. If false the cells of the battery are in serial. Some devices applies serial connection while fast charging and paralel connection while discharging Yes
2-cellIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss.
Nominal Cell Voltage (1st cell)Idle voltage of the charged battery cell 3.86 Volts
Nominal Cell Capacity (1st cell)The nominal mAh capacity of the first battery cell 2370 mAh cell
Nominal Battery Voltage (2nd cell)The nominal battery voltage of the second battery cell 3.86 Volts
Nominal Cell Capacity (2nd cell)The nominal mAh capacity of the second battery cell 930 mAh cell
Nominal Battery VoltageIf there are more than 1 cells in the battery in series connection the nominal resulting battery voltage is the sum of voltage of cells 3.86 Volts
Nominal Battery CapacityIf there are more than 1 cells in the battery in parellel connection the nominal resulting battery capacity is the sum of capacity of cells 3300 mAh battery
Nominal Battery EnergyThe product of battery capacity and nominal voltage determines the maximal nominal stored energy in the battery 12.74 Wh
Estimated Battery LifeEstimated always-on battery life of the device in case of common usage conditions 13.0 hours
Estimated Average CurrentEstimated average current is derived from battery life and battery capacity. This current is consumed while the device is used in the following state: screen backlight on (mid-level), phone (if any) on, no phone calls, no multimedia, continuous user input 254 mA
Standby TimeThe maximum standby time of the unused cell phone with active cellular radio (GSM, CDMA, iDEN, TD-SCDMA, WCDMA, LTE) and continuously refreshed dynamic RAM. 360 hours
Standby Current Calculated minimal value based on maximal standby time and nominal battery capacity (mAh). 9 mA
Talk Time:  36.0 hours
Current During TalkCalculated minimal value based on maximal talking time and nominal battery capacity (mAh). 92 mA
Wireless ChargingWireless charging (like Qi, PMA) is a kind of near-field electromagnatic power transmission methods. Inductive coupling is created between a mobile device (secondary coil) and a special charger (primary coil), usually docking station or charging pad.  Qi wireless chargingQi wireless charging standard was announced by Wireless Power Consortium in August 2009.

Geographical AttributesGeographical Attributes: 
Market CountriesCountries where the device was officially sold. Overlap is possible.  Canada
Market RegionsRegions where the device was officially sold. Overlap is possible.  North America (NA)
Mobile OperatorList of mobile operators (carriers) or distributors which sold the device in their own network Bell MobilityBell Mobility
Rogers WirelessRogers Wireless
Telus MobilityTelus Mobility

Datasheet AttributesDatasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Final
AddedThe exact time of the datasheet addition 2021-06-20 12:18
 

Samsung SM-F700W/DS Galaxy Z Flip TD-LTE CA 256GB (Samsung Bloom) Detailed Tech Specs

Samsung SM-F700W/DS Galaxy Z Flip TD-LTE CA 256GB (Samsung Bloom) Detailed Tech Specs
Platform: android A/V Out: displayport Supported Cellular Bands: gsm Supported Cellular Data Links: gprs Supported Cellular Data Links: edge Supported Cellular Data Links: umts Supported Cellular Data Links: hspa Supported Cellular Data Links: hspa_plus Supported Cellular Data Links: cdma Supported Cellular Data Links: lte Supported Cellular Data Links: lte-a Complementary Phone Services: phone Complementary Phone Services: vibration Complementary Phone Services: speakerphone USB Services: usb_otg USB Connector: usb_c Bluetooth Wireless LAN NFC Supported GPS protocol(s) Supported GLONASS protocol(s) Supported BeiDou system (BDS) Number of effective pixels: 12.2 MP camera Aux. Camera Number of Pixels : 12.0 MP aux. cam Secondary Camera Number of pixels: 10.0 MP sec. cam Built-in compass Built-in accelerometer Built-in gyroscope Additional sensors: barometer Additional sensors: fingerprint Wireless Charging

See also

Samsung SM-F7000 Galaxy Z Flip Thom Browne Edition TD-LTE CN 256GB (Samsung Bloom)
Samsung SM-F7000 Galaxy Z Flip Thom Browne Edition TD-LTE CN 256GB (Samsung Bloom)
73.6x167.3x7.2 mm, Google Android 10 (Q), Qualcomm Snapdragon 855+ SM8150-AC (Hana), 8 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2636, 300x112, 12.2 MP camera, 10.0 MP sec. cam, 3300 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F7000 Galaxy Z Flip TD-LTE CN 256GB (Samsung Bloom)
Samsung SM-F7000 Galaxy Z Flip TD-LTE CN 256GB (Samsung Bloom)
F7000ZDACHC, 73.6x167.3x7.2 mm, Google Android 10 (Q), Qualcomm Snapdragon 855+ SM8150-AC (Hana), 8 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2636, 300x112, 12.2 MP camera, 10.0 MP sec. cam, 3300 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F700N Galaxy Z Flip TD-LTE KR 256GB (Samsung Bloom)
Samsung SM-F700N Galaxy Z Flip TD-LTE KR 256GB (Samsung Bloom)
F700NZKAFML, 73.6x167.3x7.2 mm, Google Android 10 (Q), Qualcomm Snapdragon 855+ SM8150-AC (Hana), 8 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2636, 300x112, 12.2 MP camera, 10.0 MP sec. cam, 3300 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F700U/DS Galaxy Z Flip Thom Browne Edition TD-LTE US 256GB / SM-F700U (Samsung Bloom)
Samsung SM-F700U/DS Galaxy Z Flip Thom Browne Edition TD-LTE US 256GB / SM-F700U (Samsung Bloom)
73.6x167.3x7.2 mm, Google Android 10 (Q), Qualcomm Snapdragon 855+ SM8150-AC (Hana), 8 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2636, 300x112, 12.2 MP camera, 10.0 MP sec. cam, 3300 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F700U/DS Galaxy Z Flip TD-LTE US 256GB / SM-F700U (Samsung Bloom)
Samsung SM-F700U/DS Galaxy Z Flip TD-LTE US 256GB / SM-F700U (Samsung Bloom)
F700UZPDSPR, 73.6x167.3x7.2 mm, Google Android 10 (Q), Qualcomm Snapdragon 855+ SM8150-AC (Hana), 8 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2636, 300x112, 12.2 MP camera, 10.0 MP sec. cam, 3300 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F700J/DS Galaxy Z Flip TD-LTE JP SCV47 / SM-F700J (Samsung Bloom)
Samsung SM-F700J/DS Galaxy Z Flip TD-LTE JP SCV47 / SM-F700J (Samsung Bloom)
73.6x167.3x7.2 mm, Google Android 10 (Q), Qualcomm Snapdragon 855+ SM8150-AC (Hana), 8 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2636, 300x112, 12.2 MP camera, 10.0 MP sec. cam, 3300 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F700F/DS Galaxy Z Flip Global TD-LTE 256GB / SM-F700F (Samsung Bloom)
Samsung SM-F700F/DS Galaxy Z Flip Global TD-LTE 256GB / SM-F700F (Samsung Bloom)
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Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB (Samsung B6)
3 weeks ago
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Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB (Samsung B6)
3 weeks ago
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Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741R4 (Samsung B6)
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Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741R4 (Samsung B6)
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New F741UZSAUSC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741V (Samsung B6)
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Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741A (Samsung B6)
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Samsung SM-F741W Galaxy Z Flip6 5G TD-LTE CA 512GB (Samsung B6)
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Samsung SM-F741W Galaxy Z Flip6 5G TD-LTE CA 256GB (Samsung B6)
3 weeks ago
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Samsung SM-F741N Galaxy Z Flip6 5G Dual SIM TD-LTE KR 512GB (Samsung B6)
3 weeks ago
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