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IntroductionIntroduction: 
BrandBrand name of the device. This may match with the manufacturer Samsung
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated SM-J200M/DS Galaxy J2 Duos LTE LATAM
BriefBrief Introduction: One or two sentences which enumerates some important attributes of the specifc device variant described by this datasheet
The sleekly made Samsung Galaxy J2 fits comfortably in your hand or pocket
ReleasedFirst official market release date in (year, month) 2015 Dec
AnnouncedDate of the official announcement (year, month) 2015 Sep
Hardware DesignerThe company which designed this device Samsung Electronics
ManufacturerThe company which produces this device Samsung Electronics
OEM IDThe OEM ID is internal code and refers to a specific variant of the model series J200MZDDZTM
General ExtrasHardware extras like stylus, kickstand, rotatatble screen, rotatable keyboard, haptic feedback, etc.  Haptic touch feedbackHaptic (inlcuding kinesthetic) touch device applies forces and vibrations to give feedback to the user when tapping the touchscreen
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  SmartphoneCallular voice-capable usually touchscreen mobile computer which natively runs third-party apps.
List of Additional FeaturesComma separated list of low priority special features which are not included in other fields
Samsung TouchWiz UX, Opera Max

Physical AttributesPhysical Attributes: 
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 69 mm
2.72 inchWidth measured in inches
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 136.5 mm
5.37 inchHeight measured in inches
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 8.4 mm
0.33 inchesDepth measured in inches
Bounding VolumeThe volume of the smallest cuboid which can bound the device in cubecentimetres 79.1 ccm
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 130 g
4.59 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Google Android
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Google Android 5.1.1 (Lollipop)Google Android 5.1.1 (Lollipop)

Application processor, ChipsetApplication processor, Chipset: 
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 1300 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Samsung Exynos 3 Quad 3475 (Island), 2015, 32 bit, quad-core, 28 nm, ARM Mali-T720 GPUSamsung Exynos 3 Quad 3475 (Island), 2015, 32 bit, quad-core, 28 nm, ARM Mali-T720 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  Yes
RAM CapacityCapacity of the random access memory in mebibytes (binary megabytes) 1024 MiB RAM
875 MiB user accessible RAMRAM space that unprotected system and user tasks can access

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance  Flash EEPROM
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory  Yes
Non-volatile Memory CapacityNon-volatile memory in mebibytes (binary megabytes).2GB = 1907.3MiB, 4GB = 3814.7MiB, 8GB = 7629.4MiB, 16GB = 15258.8MiB, 32GB = 30517.6MiB, 64GB = 61035.2MiB, 128GB = 122070.3MiB, 256GB = 244140.6MiB, 512GB = 488281.3MiB, 1TB = 953674MiB, 2TB = 1907349Mi 7629 MiB non-volatile
4500 MiB free user storageUser-accessible partition of non-volatile storage space

DisplayDisplayAll parameters that related to display
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 119.5 mm
4.7 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 540x960
518400 pixelsThe total number of pixels is the product of horizontal and vertical number of pixels
Display WidthThe distance between the vertical edges of the display (horizontal display size). In case of display with rounded edges this refers to the smallest bounding rectangle. 58.59 mm
2.31 inchDisplay width in inches
Display HeightThe distance between the horizontal edges of the display (vertical Display Size). In case of display with rounded edges this refers to the smallest bounding rectangle. 104.15 mm
4.1 inchDisplay height in inches
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 10.41 mm
Display AreaCalculated display area is the product of max. horizontal and vertical display sizes. In case of display with rounded edges or notch this refers to the smallest display bounding rectangle. 6101.9 square millimeter
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 64.8%
Pixel SizeCalculated pixel size based on display diagonal, resolution and aspect ratio 0.10849 mm/pixel
Pixel DensityIndicates the number of pixels per inch 234 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  Color AM-OLEDColor AM-OLED (Active Matrix - Organic Light-emitting Diode) display techology. display
Display SubtypeBrand name of the subtype/technology of the screen like Super AMOLED, SLCD2/3/5, Retina Display, Reality Display, ClearBlack, etc.  Super AM-OLEDSuper AM-OLED is an improved type of AM-OLED display technology developed by Samsung where touch-sensitve layer is integrated into the screen. Super AM-OLED uses Samsung PenTile matrix RGBG subpixel arrangement (2 subpixels)
Display Color DepthColor depth defines how many colors or greyscales can be displayed 24 bit/pixel
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Display IlluminationForm of illumination used for lighting or backlighting LCD display in dark and dim ambient condtions.  Self-illuminatingOLED-based display technologies do not require illumination because they are built up from organic light-emitting diodes.
Display Subpixel SchemeSpecifies how and how many subpixels are pixels consists of. Usual schemes: RGB, RGBG, RGBW, PenTile, Diamond Pixel  RGBG PenTile Matrix (2 subpixels)PenTile RGBG is a subpixel rendering sceme developed in 1999. In a PenTile matrix each pixel has 2 subpixels. Green subpixel is shared with neighboring pixels so the pixel density can be higher but image quality is lower than RGB's.
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  No

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset ARM Mali-T720

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  No

Audio SubsystemAudio Subsystem: 
Audio Channel(s)Number of independent channels supported by the audio subsystem of the device, e.g.: mono, stereo, 5.1, 7.1, etc.  stereo

Sound Recording: 
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  mono

Sound Playing: 
Loudspeaker(s):   mono
Audio Output:   3.5mm

Cellular PhoneCellular Phone: 
Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  GSM 850MHz (B5)GSM850 phones support GSM 850 MHz (B5) band (downlink: 869.2 MHz - 894.2 MHz, uplink: 824.2 MHz - 849.2 MHz) , GSM 900MHz (B8)GSM900 phones support P-GSM (Primary GSM) 900 MHz (B8) band (downlink: 935.0 MHz - 960.0 MHz, uplink: 890.0 MHz - 915.0 MHz) and may support E-GSM (Extended GSM) 900 MHz band (downlink: 925.0 MHz - 960.0 MHz, uplink: 880.0 MHz- 915.0 MHz. , GSM 1800MHz (B3)GSM1800 phones support GSM / DCS / PCS 1800 MHz (B3) band (downlink: 1805.2 - 1879.8 MHz, uplink: 1710.2 - 1784.8 MHz). , GSM 1900MHz (PCS, B2)GSM1900 phones support PCS 1900 MHz (B2) band (downlink: 1930.2 - 1989.8 MHz, uplink: 1850.2 - 1909.8 MHz) , UMTS 2100MHz (Band I, IMT)UMTS2100 phones support UMTS 1900 / 2100MHz (IMT, also refferred as UMTS Band I) band (downlink: 2112.4 - 2167.6 MHz, uplink: 1922.4-1977.6 MHz) , UMTS 1900MHz (Band II, PCS)UMTS1900 phones support UMTS 1900MHz (PCS, also refferred as UMTS Band II) band (downlink: 1932.4 - 1987.6 MHz, uplink: 1852.4-1907.6 MHz) , UMTS 1700/2100MHz (Band IV, AWS)UMTS1700/2100 phones support UMTS 1700 / 2100 MHz (AWS, also refferred as UMTS Band IV) band (downlink: 2112.4 - 2152.6 MHz, uplink: 1712.4-1752.6 MHz) , UMTS 850MHz (Band V, CLR)UMTS850 phones support UMTS 850 MHz (CLR, also refferred as UMTS Band V) band (downlink: 871.4 - 891.6 MHz, uplink: 826.4 - 846.6 MHz) , UMTS 900MHz (Band VIII)UMTS900 phones support UMTS 900 MHz (UMTS Band VIII) band (downlink: 927.4 - 957.6 MHz, uplink: 882.4-912.6 MHz) , LTE 2100 MHz (Band 1)LTE2100 phones support LTE 1900 / 2100MHz (IMT, also refferred as LTE Band 1) band (downlink: 2110 - 2170 MHz, uplink: 1920 - 1980 MHz) , LTE 1900 MHz (Band 2, PCS)LTE1900 phones support LTE 1900 MHz (PCS , also referred as LTE Band 2) band (downlink: 1930 - 1990 MHz, uplink: 1850 - 1910 MHz) , LTE 1800 MHz (Band 3)LTE1800 phones support LTE 1800 MHz (LTE Band 3) band (downlink: 1805 - 1880 MHz, uplink: 1710 - 1785 MHz) , LTE 1700/2100 MHz (Band 4, AWS)LTE1700/2100 phones support LTE 1700 / 2100 MHz (AWS also referred as LTE Band 4) band (downlink: 2110 - 2155 MHz, uplink: 1710 - 1755 MHz) , LTE 850 MHz (Band 5)LTE850 phones support LTE 850 MHz (LTE Band 5) band (downlink: 869 - 894 MHz, uplink: 824 - 849 MHz) , LTE 2600 MHz (Band 7)LTE2600 phones support LTE 2600 MHz (LTE Band 7) band (downlink: 2620 - 2690 MHz, uplink: 2500 - 2570 MHz) , LTE 900 MHz (Band 8)LTE900 phones support LTE 900 MHz (LTE Band 8) band (downlink: 925 - 960 MHz, uplink: 880 - 915 MHz) , LTE 700 MHz (Band 17)LTE700 phones support LTE 700 MHz (LTE Band 17) band (downlink: 734 - 746 MHz, uplink: 704 - 716 MHz) , LTE 700 MHz (Band 28)APT700 phones support LTE 700 MHz (LTE Band 28) band (downlink: 758 - 803 MHz, uplink: 703 - 748 MHz) bands
Supported Cellular Data LinksList of supported cellular data links and rates.  GPRS (Class unspecified)General Packet Radio Service , EDGE (Class unspecified)Enhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS) , UMTS 384 kbps (W-CDMA)Universal Mobile Telecommunications System. UMTS Release '99 data link layer, W-CDMA grants up to 384 kbit/s pocket-switched download speed. , HSUPA (Cat. unspecified)High-Speed Uplink Packet Access is a 3.5G UMTS uplink protocol. , HSUPA 5.76 Mbps (Cat. 6) , HSDPA (Cat. unspecified)High-Speed Downlink Packet Access is a 3.5G UMTS downlink protocol. , HSPA+ 21.1 Mbps (Cat. 18) , HSPA+ 42.2 Mbps (Cat. 20)Single-carrier HSPA+ 42.2 Mbps , LTE (Cat. unspecified)LTE (Long Term Evolution) or the E-UTRAN (Evolved Universal Terrestrial Access Network), introduced in 3GPP R8, is the 4G access part of the Evolved Packet System (EPS). , LTE 150 Mbps / 50 Mbps (Cat. 4)LTE 151.2 Mbps / 50.4 Mbps (Cat. 4) data links
SIM Card SlotSupported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc.  Micro-SIM (3FF)
Cellular AntennaPhysical antenna layout. Most common type: internal. Historic types: fixed external, pull-out, open-out  Internal antenna
Call Alert SoundPolyphonic or monophonic call alert sound (number of chords) 64-chord melody
Complementary Phone ServicesPossible extras: voice transmission, voice speaker, vibration, speakerphone, active noise cancellation, PTT, HD Voice, VoLTE, etc.  Voice transmissionDevice is able to receive and transmit voice over cellular network , Voice speakerDedicated voice speaker is located near to the ear when talking and optimized for the spectrum and peak-to-peak range of the human voice. , Vibrating Alert , Speakerphone

Secondary Cellular PhoneSecondary Cellular Phone: 
Dual Cellular Network OperationDetermines how the device can handle multiple cellular networks and SIM cards. For example dual-standy, dual-active  Dual standbyCellular modules of dual standby phones can simultaneous connect to the same (e.g. GSM/GSM, LTE/LTE) or different (e.g. CDMA/GSM) network. During call or data transmission on any cellular modules the other cellular module is automatically switched off
Sec. Supported Cellular Networks:   GSM 850MHz (B5)GSM850 phones support GSM 850 MHz (B5) band (downlink: 869.2 MHz - 894.2 MHz, uplink: 824.2 MHz - 849.2 MHz) , GSM 900MHz (B8)GSM900 phones support P-GSM (Primary GSM) 900 MHz (B8) band (downlink: 935.0 MHz - 960.0 MHz, uplink: 890.0 MHz - 915.0 MHz) and may support E-GSM (Extended GSM) 900 MHz band (downlink: 925.0 MHz - 960.0 MHz, uplink: 880.0 MHz- 915.0 MHz. , GSM 1800MHz (B3)GSM1800 phones support GSM / DCS / PCS 1800 MHz (B3) band (downlink: 1805.2 - 1879.8 MHz, uplink: 1710.2 - 1784.8 MHz). , GSM 1900MHz (PCS, B2)GSM1900 phones support PCS 1900 MHz (B2) band (downlink: 1930.2 - 1989.8 MHz, uplink: 1850.2 - 1909.8 MHz)
Sec. Supported Cellular Data Links:   GPRS (Class unspecified)General Packet Radio Service , EDGE (Class unspecified)Enhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS)
Sec. SIM Card SlotSecondary Supported Subscriber Identification Card (SIM) Format  Micro-SIM (3FF)
Internal antenna
Sec. Phone Controller IC:  Qualcomm MSM8916

Control PeripheralsControl Peripherals: 
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch sensing screen
Touchscreen Simultaneous Touch PointsDetermines how many touches the touch-sensitive screen module is able to simultaneously detect at most  5-point


Communication InterfacesCommunication Interfaces: 
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  TransFlash , microSDSupports memory cards with capacity of up to 2GB and may comply with some (not HC) memory cards with higher capacity than 2GB , microSDHCA micro-SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB. , microSD Extended CapacityA microSDXC-capable device supports eXtended-Capacity memory cards with capacity of up to 128 GB, 256 GB or 2 TB.
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB Hi-Speed (480 Mbps)Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB chargingThe device is able to charge its battery supplied from the USB port. , USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc. , USB On-The-Go 1.3 , USB Power DeliveryDevice which meets USB Battery Charging Specification Revision 1.1 / 1.2 is able to supply current from 500 mA to 1.5 A for the client device at 5V.
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  USB Series Micro-AB
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Bluetooth 4.1Bluetooth 4.1 is an evolutionary update to the Bluetooth Core Specification. It rolls up adopted Bluetooth Core Specification Addenda (CSA1, 2, 3 & 4) while adding new features and benefits. Bluetooth 4.1 improves usability for consumers, empowers inn
Internal antenna
Bluetooth profilesList of supported Bluetooth profiles e.g. aptX, A2DP, AVRCP, HSP, HID, PBA, PAN, OPP, MAP  A2DPAdvanced Audio Distribution Profile , AVRCPAudio/Video Remote Control Profile (AVRCP) , DIPDevice ID Profile (DIP) , HFPHands-Free Profile (HFP) , HIDHuman Interface Device Profile (HID) , MAPMessage Access Profile (MAP) , OPPObject Push Profile (OPP) , PANPersonal Area Networking Profile (PAN)
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  IEEE 802.11b2.4 GHz (ISM band), max. 11 Mbit/s , IEEE 802.11g2.4 GHz (ISM band), max. 54 Mbit/s , IEEE 802.11n2.4 GHz (ISM band) or optional 5 GHz support, max. 600 Mbit/s thanks to MIMO antennas
Internal antenna
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc.  Wi-Fi Direct

Multimedia BroadcastMultimedia Broadcast: 
FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  FM radio (76-90 MHz) with RDS
Proprietary headset as antennaIn small devices antenna of the FM radio receiver does not fit into the house of the device and external components needed (e.g. headset as antenna or external antenna)

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s)Possible protocols: NMEA 0183, SIRF, etc.  GPS (NMEA 0183)NMEA 0183
Satellite Antenna:   Internal antenna
Complementary Satellite ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  Simultaneous GPS (S-GPS) , Assisted GPS , Geotagging , QuickGPS
Supported GLONASS protocol(s)GLONASS is a global satellite navigation system operated by Russia.  L1OFGLONASS L1OF FDMA signal centered at 1602 MHz, features a BPSK(0.5) modulation.
Navigation ControllerManufacturer part number of the GNSS (GPS, GLONASS, Galileo and/or BDS) controller IC or commercial name of the intellectual property (IP) if the controller is the part of a chipset Samsung Exynos 3475

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any
Camera PlacementRefers to the placement of the primary camera on the device. Front, rear or rotatable. Generally rear.  Rear
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  CMOSComplementary MOS circuit
Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the camera can take a picture 2532x1976 pixel
Number of effective pixelsA measurement of the maximum pixel number at which the camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 5.0 MP camera
Aperture (W)Wide-angle aperture of lens or aperture of lens in case of camera without optical zoom f/2.20
ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1.0 x optical zoom
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  Contrast Detection Autofocus (CD AF)Contrast-detection (CD) is a passive autofocus method without distance measurement which adjusts the optical system until maximum contrast is measured through the lens.
Recordable Image FormatsSupported file formats while capturing photos by primary camera  JPG
Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the primary camera can capture video 1280x960 pixel
30 fpsRecording frame rate when recording video at maximum resolution
Recordable Video FormatsSupported file formats while capturing videos  3GP , 3G2 , MPEG4
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  single LEDAlso known as mobile light
Camera Extra FunctionsPopular extra features of the primary camera: EIS, EIS for video, OIS, OIS for video, Face detection, 3D photo, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, Burst mode, Face Retouch  Macro modeAn autofocus feature that allows for close-up photographs to be taken with the onboard digital camera , Panorama Photo , Face detection

Auxiliary Camera: 
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  No

Auxiliary Camera No. 2: 
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No

Auxiliary Camera No. 3: 
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No

Auxiliary Camera No. 4: 
Aux. 4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No
Aux. 4 Camera FocusFocusing method of the fourth auxiliary camera  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies
Secondary Camera PlacementRefers to the placement of the secondary camera on the device. Front or rear. Generally front camera for selfies or video call.  Front
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  CMOSComplementary MOS circuit
Secondary Camera ResolutionA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can take a picture 1600x1200 pixel
Secondary Camera Number of pixelsA measurement of the maximum pixel number at which the sec. camera can take a picture, often referred to as Megapixels (when horizontal and vertical measurements are multiplied) 1.9 MP sec. cam
Secondary Aperture (W)Wide-angle aperture of lens or aperture of lens in case of secondary camera without optical zoom f/2.40
Secondary Recordable Image FormatsSupported file formats while capturing photos by secondary camera  JPG
Secondary Video RecordingA measurement of the maximum horizontal and vertical pixel numbers at which the secondary camera can capture video 800x600 pixel
30 fpsRecording frame rate when recording video by the secondary camera at maximum resolution
Secondary Recordable Video FormatsSupported file formats while capturing videos by the secondary camera  3GP

Secondary Auxiliary Camera: 
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  No

Secondary Auxiliary Camera No. 2: 
Sec. Aux. 2 Cam. Image SensorImage sensor technology of sec. auxiliary 2 camera in at least triple lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 
Built-in compassBuilt-in electroinc compass types: 1D, 2D, 3D  Yes
Built-in accelerometerAn internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis. Possible types: 1D, 2D, 3D  Yes
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  Hall sensor , Light intensity sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen , Proximity sensorBased on this sensor signal device may control the volume of the voice speaker or dim the display during a call

Ingress ProtectionIngress Protection: 
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  Yes

Power SupplyPower Supply: 
BatteryBattery technology  Lithium-ion
removablePossible options: removable, built-in
1-cellIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss.
Nominal Cell Capacity (1st cell)The nominal mAh capacity of the first battery cell 2000 mAh cell
Nominal Battery CapacityIf there are more than 1 cells in the battery in parellel connection the nominal resulting battery capacity is the sum of capacity of cells 2000 mAh battery
Estimated Battery LifeEstimated always-on battery life of the device in case of common usage conditions 11.0 hours
Estimated Average CurrentEstimated average current is derived from battery life and battery capacity. This current is consumed while the device is used in the following state: screen backlight on (mid-level), phone (if any) on, no phone calls, no multimedia, continuous user input 182 mA
Talk Time:  12.0 hours
Current During TalkCalculated minimal value based on maximal talking time and nominal battery capacity (mAh). 167 mA

Geographical AttributesGeographical Attributes: 
Market CountriesCountries where the device was officially sold. Overlap is possible.  Argentina , Bolivia , Brazil , Chile , Colombia , Ecuador , Guatemala , Nicaragua , Panama , Paraguay , Peru
Market RegionsRegions where the device was officially sold. Overlap is possible.  Central America , Southeast Asia

Datasheet AttributesDatasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2022-05-26 12:18
 

Samsung SM-J200M/DS Galaxy J2 Duos LTE LATAM Detailed Tech Specs

Samsung SM-J200M/DS Galaxy J2 Duos LTE LATAM Detailed Tech Specs
Platform: android Audio Output: audio_jack Supported Cellular Bands: gsm Supported Cellular Data Links: gprs Supported Cellular Data Links: edge Supported Cellular Data Links: umts Supported Cellular Data Links: hspa Supported Cellular Data Links: hspa_plus Supported Cellular Data Links: lte Complementary Phone Services: phone Complementary Phone Services: vibration Complementary Phone Services: speakerphone Dual Cellular Network Operation Expansion Interfaces USB Services: usb_otg Bluetooth Wireless LAN FM Radio Receiver Supported GPS protocol(s) Supported GLONASS protocol(s) Number of effective pixels: 5.0 MP camera Aux. Camera Number of Pixels : 0.0 MP aux. cam Secondary Camera Number of pixels: 1.9 MP sec. cam Built-in compass Built-in accelerometer

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New F741ULGEUSC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741R4 (Samsung B6)
2 weeks ago
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741R4 (Samsung B6)
New F741UZSAUSC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741V (Samsung B6)
2 weeks ago
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741V (Samsung B6)
New F741ULBEVZW, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741V (Samsung B6)
2 weeks ago
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741V (Samsung B6)
New F741UZSAVZW, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741T (Samsung B6)
2 weeks ago
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741T (Samsung B6)
New F741UZYEXAU, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741T (Samsung B6)
2 weeks ago
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741T (Samsung B6)
New F741ULGAXAU, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741A (Samsung B6)
2 weeks ago
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741A (Samsung B6)
New F741ULBEATT, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741A (Samsung B6)
2 weeks ago
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741A (Samsung B6)
New F741UZSAATT, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741W Galaxy Z Flip6 5G TD-LTE CA 512GB (Samsung B6)
2 weeks ago
Samsung SM-F741W Galaxy Z Flip6 5G TD-LTE CA 512GB (Samsung B6)
New F741WZYEXAC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741W Galaxy Z Flip6 5G TD-LTE CA 256GB (Samsung B6)
2 weeks ago
Samsung SM-F741W Galaxy Z Flip6 5G TD-LTE CA 256GB (Samsung B6)
New F741WAKAXAC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741N Galaxy Z Flip6 5G Dual SIM TD-LTE KR 512GB (Samsung B6)
2 weeks ago
Samsung SM-F741N Galaxy Z Flip6 5G Dual SIM TD-LTE KR 512GB (Samsung B6)
New F741NZOEKOO, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741N Galaxy Z Flip6 5G Dual SIM TD-LTE KR 256GB (Samsung B6)
2 weeks ago
Samsung SM-F741N Galaxy Z Flip6 5G Dual SIM TD-LTE KR 256GB (Samsung B6)
New F741NLBAKOO, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F7410 Galaxy Z Flip6 5G Dual SIM TD-LTE CN HK TW 512GB (Samsung B6)
2 weeks ago
Samsung SM-F7410 Galaxy Z Flip6 5G Dual SIM TD-LTE CN HK TW 512GB (Samsung B6)
New F7410ZWEBRI, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F7410 Galaxy Z Flip6 5G Dual SIM TD-LTE CN HK TW 256GB (Samsung B6)
2 weeks ago
Samsung SM-F7410 Galaxy Z Flip6 5G Dual SIM TD-LTE CN HK TW 256GB (Samsung B6)
New F7410LGATGY, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741J Galaxy Z Flip6 5G Dual SIM TD-LTE JP 256GB SCG29 (Samsung B6)
2 weeks ago
Samsung SM-F741J Galaxy Z Flip6 5G Dual SIM TD-LTE JP 256GB SCG29 (Samsung B6)
New F741JZYAKDI, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741J Galaxy Z Flip6 5G Dual SIM TD-LTE JP 512GB SCG29 (Samsung B6)
2 weeks ago
Samsung SM-F741J Galaxy Z Flip6 5G Dual SIM TD-LTE JP 512GB SCG29 (Samsung B6)
New F741JZSEKDI, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741D Galaxy Z Flip6 5G Dual SIM TD-LTE JP 256GB SC-54E (Samsung B6)
2 weeks ago
Samsung SM-F741D Galaxy Z Flip6 5G Dual SIM TD-LTE JP 256GB SC-54E (Samsung B6)
New F741DLBADCM, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741Q Galaxy Z Flip6 5G Dual SIM TD-LTE JP 512GB (Samsung B6)
3 weeks ago
Samsung SM-F741Q Galaxy Z Flip6 5G Dual SIM TD-LTE JP 512GB (Samsung B6)
New F741QZSESJP, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

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