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IntroductionIntroduction: 
BrandBrand name of the device. This may match with the manufacturer Hivision
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated PWS700FS
ReleasedFirst official market release date in (year, month) 2010 Mar
Hardware DesignerThe company which designed this device Hivision
ManufacturerThe company which produces this device Hivision
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  TabletHandheld touchscreen mobile computer which is able to natively run third-party applications and does not support voice calling without headset or speakerphone.
List of Additional FeaturesComma separated list of low priority special features which are not included in other fields
1x USB A host port, 1x mini-USB port, A/V out port

Physical AttributesPhysical Attributes: 
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device N/A

Software EnvironmentSoftware Environment: 
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Windows (mobile-class)Windows embedded for smartphones, PDAs, palmtops, tablets, rugged handhelds, automotive devices and other real-time and embedded applications
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Microsoft Windows Embedded CE 6.0 (Yamazaki)Microsoft Windows Embedded CE 6.0 (Yamazaki)
Operating System Kernel VersionThe OS kernel is the primary component of an operating system which manages hardware and software resources, schedules tasks and threads and provides interface for the upper software layers (system calls, interrupts, APIs, etc.) 6.00

Application processor, ChipsetApplication processor, Chipset: 
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 667 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Samsung S3C6410, 2008, 32 bit, single-core, 16 Kbyte I-Cache, 16 Kbyte D-Cache, 65 nmSamsung S3C6410, 2008, 32 bit, single-core, 16 Kbyte I-Cache, 16 Kbyte D-Cache, 65 nm

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  DDR2 SDRAM
RAM CapacityCapacity of the random access memory in mebibytes (binary megabytes) 256 MiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance  Flash EEPROM
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory  Yes
Non-volatile Memory CapacityNon-volatile memory in mebibytes (binary megabytes).2GB = 1907.3MiB, 4GB = 3814.7MiB, 8GB = 7629.4MiB, 16GB = 15258.8MiB, 32GB = 30517.6MiB, 64GB = 61035.2MiB, 128GB = 122070.3MiB, 256GB = 244140.6MiB, 512GB = 488281.3MiB, 1TB = 953674MiB, 2TB = 1907349Mi 1908 MiB non-volatile

DisplayDisplayAll parameters that related to display
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 178 mm
7 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 800x480
384000 pixelsThe total number of pixels is the product of horizontal and vertical number of pixels
Display WidthThe distance between the vertical edges of the display (horizontal display size). In case of display with rounded edges this refers to the smallest bounding rectangle. 152.63 mm
6.01 inchDisplay width in inches
Display HeightThe distance between the horizontal edges of the display (vertical Display Size). In case of display with rounded edges this refers to the smallest bounding rectangle. 91.58 mm
3.61 inchDisplay height in inches
Display AreaCalculated display area is the product of max. horizontal and vertical display sizes. In case of display with rounded edges or notch this refers to the smallest display bounding rectangle. 13978.2 square millimeter
Pixel SizeCalculated pixel size based on display diagonal, resolution and aspect ratio 0.19079 mm/pixel
Pixel DensityIndicates the number of pixels per inch 133 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  Color TN-TFT LCDColor TN-TFT (Twisted Nematic - Thin Film Transistor). This is an active matrix LCD technology. display
Display Color DepthColor depth defines how many colors or greyscales can be displayed 24 bit/pixel
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Display IlluminationForm of illumination used for lighting or backlighting LCD display in dark and dim ambient condtions.  Yes
Display Light Reflection ModeThe ratio between reflected and transmitted light depends on reflection mode thus display technology. Possible options: transflective, reflective, transmissive, etc.  transflectiveTransflective LCD has medium reflectance factor. Hence it reflects and transmits the incident ambient light. It does not need backlighting and well readable in bright sunlight but can be backlit in dark ambient conditions without reducing readibility.
Display Subpixel SchemeSpecifies how and how many subpixels are pixels consists of. Usual schemes: RGB, RGBG, RGBW, PenTile, Diamond Pixel  RGB Matrix (3 subpixels)Each pixel has 3 subpixel (Red, Greed, Blue) with the same size. The subpixel order is often R-G-B but B-G-R is also used.
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  No

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset N/A

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  No

Audio SubsystemAudio Subsystem: 
Audio Channel(s)Number of independent channels supported by the audio subsystem of the device, e.g.: mono, stereo, 5.1, 7.1, etc.  stereo

Sound Recording: 
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  mono
Microphone InputThis jack allows the user to connect external microphone to the device  3.5mm

Sound Playing: 
D/A Converter Nominal ResolutionThe resulution (R) of the digital/analog converter which converts a series of R-wide binary samples to the analog voltage signal of the built-in speaker or audio out 16 bit quantization
D/A Holding FrequencyThe maximum holding frequency of the digital/analog converter 48000 Hz
Loudspeaker(s):   stereo
Audio Output:   3.5mm

Cellular PhoneCellular Phone: 
Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  No

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Resistive touch sensing screen
Touchscreen Simultaneous Touch PointsDetermines how many touches the touch-sensitive screen module is able to simultaneously detect at most  Single-touch
Directional PadA four-way mechanism that allows the selection of certain on-screen objects  Four-way (with action button)-way


Communication InterfacesCommunication Interfaces: 
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  MMCMultiMediaCard , SDSupports memory cards with capacity of up to 2GB and may comply with some (not SD 2.0/HC) memory cards with higher capacity than 2GB , Secure Digital Input/Output interfaceSupports peripheral devices inserted into SD card slot. , SD High CapacityAn SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB.
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB Hi-Speed (480 Mbps)Determines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc.  USB HostUSB host devices are capable of controlling USB client devices, like mass storage devices, mouse, keyboard, camera, printer, scanner, etc. , USB Power DeliveryDevice which meets USB Battery Charging Specification Revision 1.1 / 1.2 is able to supply current from 500 mA to 1.5 A for the client device at 5V.
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  USB Series A
USB2Second USB port  Yes
Yes
USB2 connector:   USB Series Mini-B (mini-USB)
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  No
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  IEEE 802.11b2.4 GHz (ISM band), max. 11 Mbit/s , IEEE 802.11g2.4 GHz (ISM band), max. 54 Mbit/s
Internal antenna
LANEthernet (IEEE 802.3): High-speed wired connection that allows the transfer of data directly to and from a network or internet source  100 BASE-T (100Mbit/s)
LAN Connector:   8P8C ("RJ-45")

Multimedia BroadcastMultimedia Broadcast: 
FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  No

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s)Possible protocols: NMEA 0183, SIRF, etc.  No

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  No
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  No
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  No

Auxiliary Camera: 
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  No

Auxiliary Camera No. 2: 
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No

Auxiliary Camera No. 3: 
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No

Auxiliary Camera No. 4: 
Aux. 4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No
Aux. 4 Camera FocusFocusing method of the fourth auxiliary camera  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  No

Secondary Auxiliary Camera: 
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  No

Secondary Auxiliary Camera No. 2: 
Sec. Aux. 2 Cam. Image SensorImage sensor technology of sec. auxiliary 2 camera in at least triple lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 
Built-in accelerometerAn internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis. Possible types: 1D, 2D, 3D  No

Ingress ProtectionIngress Protection: 
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  Yes

Power SupplyPower Supply: 
BatteryBattery technology  Lithium-ion
built-inPossible options: removable, built-in
1-cellIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss.
Nominal Cell Capacity (1st cell)The nominal mAh capacity of the first battery cell 3000 mAh cell

Geographical AttributesGeographical Attributes: 

Datasheet AttributesDatasheet Attributes: 
Related Page:  URL
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2010-07-18 23:24
 

Hivision PWS700FS Detailed Tech Specs

Hivision PWS700FS Detailed Tech Specs
Platform: windows Microphone Input: audio_jack Expansion Interfaces Wireless LAN LAN Number of effective pixels: 0.0 MP camera Aux. Camera Number of Pixels : 0.0 MP aux. cam Secondary Camera Number of pixels: 0.0 MP sec. cam

See also

Hivision PWS0890AW
Hivision PWS0890AW
Microsoft Windows Embedded CE 6.0 (Yamazaki), Samsung S3C2450, 128 MiB RAM, 8 GB ROM, 8.9 inch, 1024x600 | All detailsAll details | Add this item to the comparisonAdd to compare

Hivision PWS800B 8GB
Hivision PWS800B 8GB
Microsoft Windows Embedded CE 6.0 R3, 128 MiB RAM, 8 GB ROM, 8 inch, 800x480 | All detailsAll details | Add this item to the comparisonAdd to compare

Hivision PWS800B
Hivision PWS800B
Microsoft Windows Embedded CE 6.0 R3, 128 MiB RAM, 2 GB ROM, 8 inch, 800x480 | All detailsAll details | Add this item to the comparisonAdd to compare

Hivision PWS700CA
Hivision PWS700CA
Google Android 1.5 (Cupcake), Rockchip RK2808, 128 MiB RAM, 2 GB ROM, 7 inch, 800x480 | All detailsAll details | Add this item to the comparisonAdd to compare

Hivision PWS700B
Hivision PWS700B
128 MiB RAM, 2 GB ROM, 7 inch, 800x480 | All detailsAll details | Add this item to the comparisonAdd to compare

Hivision PWS700EW
Hivision PWS700EW
Microsoft Windows Embedded CE 6.0 (Yamazaki), 128 MiB RAM, 2 GB ROM, 7 inch, 800x480 | All detailsAll details | Add this item to the comparisonAdd to compare

Hivision PWS700AW
Hivision PWS700AW
Microsoft Windows Embedded CE 6.0 R3, 128 MiB RAM, 2 GB ROM, 7 inch, 800x480 | All detailsAll details | Add this item to the comparisonAdd to compare

Hivision PWS500A
Hivision PWS500A
Microsoft Windows CE 5.0 (Macallan), Telechip TCC7901, 128 MiB RAM, 2 GB ROM, 5 inch, 800x480, 1800 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Hivision PWS500B
Hivision PWS500B
Microsoft Windows Embedded CE 6.0 (Yamazaki), SiRF atlasIV, 128 MiB RAM, 2 GB ROM, 5 inch, 800x480, 1800 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

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