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IntroductionIntroduction: 
BrandBrand name of the device. This may match with the manufacturer Samsung
ModelOne or more (separated by /) specific model name identifies this device. This field often includes Model Code too which can be separated SM-R730V Gear S2 CDMA
ReleasedFirst official market release date in (year, month) 2015 Nov
Hardware DesignerThe company which designed this device Samsung Electronics
ManufacturerThe company which produces this device Samsung Electronics
CodenameThe codename internally identified the design project of this product. Model variants of the same model are identified and linked to each other via the same Codename Samsung Orbis
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc.  SmartwatchSmart watch is a kind of wearable computers which is able to manage phone calls in cooperation with smartphones or tablets. It may have various built-in sensors to support sport and fitness activites.

Physical AttributesPhysical Attributes: 
WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 43.9 mm
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 55.2 mm
DepthDepth refers to the thickness of the device. Depth is usually the smallest dimension of the device 13.4 mm
DimensionsAll dimensions are maximal values (measured between the furthest points of the device) in closed state 1.73x2.17x0.53 inches
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 51 g
1.8 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment: 
PlatformThe family of the operating system like Android, iOS, Windows Phone/Mobile, Palm OS, etc.  Linux
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Samsung Tizen Wearable PlatformSamsung Tizen Wearable Platform
2.3.1Subversion, update version, user interface, defualt language, etc.

Application processor, ChipsetApplication processor, Chipset: 
CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 1200 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Qualcomm Snapdragon 400 MSM8626, 2013, 32 bit, quad-core, 16 Kbyte I-Cache, 16 Kbyte D-Cache, 1024 Kbyte L2, 28 nm, Qualcomm Adreno 305 GPUQualcomm Snapdragon 400 MSM8626, 2013, 32 bit, quad-core, 16 Kbyte I-Cache, 16 Kbyte D-Cache, 1024 Kbyte L2, 28 nm, Qualcomm Adreno 305 GPU

Operative MemoryOperative Memory: 
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM).  Yes
RAM Capacity (converted)RAM capacity in binary bytes (KiB: 1024 bytes, MiB: 1024 KiB, GiB: 1024 MiB) 512 MiB RAM

Non-volatile MemoryNon-volatile Memory: 
Non-volatile Memory InterfaceInterface (e.g. UFS 2.0, eMMC 5.1, moviNAND) which determines physical layer (width, clock rate, lanes, protocol) of data transfer between the application processor and the NV memory  eMMC 4.5Complies with embedded MMC 4.5 specification released in 2011
Non-volatile Memory Capacity (converted)The value of ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) 4 GB ROM
2100 MiB total user storageThe sum of primary and secondary user-accessible partition of non-volatile storage spaces

DisplayDisplayAll parameters that related to display
Display DiagonalThe distance measured between the furthest corners of the display. In case of display with rounded edges this refers to the diagonal of the smallest bounding rectangle. 30 mm
1.2 inchDisplay Diagonal in inches
ResolutionHorizontal and vertical resolution of the primary display. In case of display with rounded edges this refers to the smallest bounding rectangle. 360x360
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 22.69 mm
Display Area UtilizationRegular display area per regular front panel area ratio. This approximated indicator does not count with possible rounded corners (neither on front panel nor on display) or display notches, holes. 18.6%
Pixel DensityIndicates the number of pixels per inch 431 PPI
Display TypeDisplay technology, e.g. Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT  AM-OLEDColor AM-OLED (Active Matrix - Organic Light-emitting Diode) display techology. display
Display SubtypeBrand name of the subtype/technology of the screen like Super AMOLED, SLCD2/3/5, Retina Display, Reality Display, ClearBlack, etc.  Super AM-OLEDSuper AM-OLED is an improved type of AM-OLED display technology developed by Samsung where touch-sensitve layer is integrated into the screen. Super AM-OLED uses Samsung PenTile matrix RGBG subpixel arrangement (2 subpixels)
Number of Display ScalesMaximal number of displayable colors or scales 16.8M
Scratch Resistant ScreenUsual types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass  Gorilla Glass 3Introduced in 2013

Graphical SubsystemGraphical Subsystem: 
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset Qualcomm Adreno 305
Dedicated Graphics MemoryDedicated operative memory (video RAM, VRAM) of graphics controller or GPU which independent from the op. memory of the main processor. Graphics controller may have access to the main RAM (shared RAM) too 0.25 MiB

Audio/Video InterfacesAudio/Video Interfaces: 
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e  No

Audio SubsystemAudio Subsystem: 
Microphone(s)Analog or digital sound receiver. Main applications: voice calls, active noise cancellation, voice command, voice/video recording, voice identification  mono
Loudspeaker(s):   mono
Audio Output:   No

Cellular PhoneCellular Phone: 
Supported Cellular BandsList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands.  CDMA800 (BC0)CDMA800 phones support CDMA 800 MHz (CDMA Band Class 0, also known as CDMA850) band (downlink: 860 MHz - 894 MHz, uplink: 815 MHz - 849 MHz). , CDMA1900 (BC1/BC14)CDMA1900 phones support PCS, also referred as CDMA Band Class 1 band (downlink: 1930 - 1990 MHz, uplink: 1850 - 1910 MHz) and US PCS, also referred as CDMA Band Class 14 band (downlink: 1930 - 1995 MHz, uplink: 1850 - 1915 MHz) bands
Supported Cellular Data LinksList of supported cellular data links and rates.  cdmaOne , CDMA2000 1x , CDMA2000 1xEV-DO data links
SIM Card SlotSupported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc.  e-SIM
Complementary Phone ServicesPossible extras: voice transmission, voice speaker, vibration, speakerphone, active noise cancellation, PTT, HD Voice, VoLTE, etc.  Voice transmissionDevice is able to receive and transmit voice over cellular network , Voice speakerDedicated voice speaker is located near to the ear when talking and optimized for the spectrum and peak-to-peak range of the human voice.

Secondary Cellular PhoneSecondary Cellular Phone: 
Sec. Supported Cellular Networks:   No

Control PeripheralsControl Peripherals: 
Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen  Capacitive multi-touch screen

Communication InterfacesCommunication Interfaces: 
Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc.  No
USBFirst or the only USB port. USB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard.  No
NoDetermines the highest available data transfer speed of first USB port. Usual standard speed levels: High-Speed (HS), Super-Speed (SS)
USB ConnectorPhysical USB connector layout. Most common types: micro-USB, USB A, USB Type-C or proprietary (e.g. Lightning)  No
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version.  Bluetooth 4.1Bluetooth 4.1 is an evolutionary update to the Bluetooth Core Specification. It rolls up adopted Bluetooth Core Specification Addenda (CSA1, 2, 3 & 4) while adding new features and benefits. Bluetooth 4.1 improves usability for consumers, empowers inn
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (e.g. 802.11a/b/g/n).  802.11b2.4 GHz (ISM band), max. 11 Mbit/s , 802.11e , 802.11g2.4 GHz (ISM band), max. 54 Mbit/s , 802.11n2.4 GHz (ISM band) or optional 5 GHz support, max. 600 Mbit/s thanks to MIMO antennas
NFCNear Field Communication is short-range wireless radio data exchange technology based on radio-frequency identification (RFID). This field enumerates the supported NFC technologies.  Yes

Multimedia BroadcastMultimedia Broadcast: 
FM Radio ReceiverWith a bulit-in FM radio the device is able to receive FM (frequency modulated) broadcast in 79 - 108 MHz band.  No


Satellite NavigationSatellite Navigation: 
Complementary Satellite ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc.  A-GPS , QuickGPS
Supported GLONASS protocol(s)GLONASS is a global satellite navigation system operated by Russia.  L1OFGLONASS L1OF FDMA signal centered at 1602 MHz, features a BPSK(0.5) modulation.

Primary Camera SystemPrimary Camera SystemPrimary camera usually has better imaging capabilities than secondary camera if any
Camera Image SensorRefers to the semiconductor technology of image sensor (FSI CMOS, BSI CMOS, etc.)  No
FocusCD AF, PD AF, Laser AF, etc. No / Not supported means there is no adjustable optical system or no camera built-in at all  No
FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight. This field contains the exact type of the flash.  No
Aux. Camera Image SensorAuxiliary camera image sensor technology in at least dual lens setup  No
Aux. 2 Camera Image SensorAuxiliary 2 camera image sensor technology in at least triple lens setup  No
Aux. 3 Camera Image SensorAuxiliary 3 camera image sensor technology in at least quad lens setup  No
Aux. 4 Camera Image SensorAuxiliary 4 camera image sensor technology in at least penta lens setup  No

Secondary Camera SystemSecondary Camera SystemWidely used for video telephony or taking selfies
Secondary Camera SensorRefers to the semiconductor technology of sec camera image sensor (FSI CMOS, BSI CMOS, etc.)  No
Sec. Aux. Cam. Image SensorImage sensor technology of sec. auxiliary camera in at least dual lens secondary camera setup  No

Built-in SensorsBuilt-in Sensors: 
Built-in accelerometerAn internal component that senses acceleration components of the device. Used for automatic screen rotation and for games and applications that rely on acceleration measurement on X, Y, and Z axis. Possible types: 1D, 2D, 3D  Yes
Built-in gyroscopeAn internal component that senses the orientation of the device. Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D  Yes
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors  Barometer , HR sensor , L sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen

Ingress ProtectionIngress Protection: 
Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials  6 Totally protected from dust
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids  8 Protected against immersion beyond 1m of depth

Power SupplyPower Supply: 
BatteryBattery technology  Li-ion polymer (LiPo)
built-inPossible options: removable, built-in
1-cellIn case of high power consumption it is more efficient to connect more than 1 cells in the battery in series to minimize current thus loss.
Nominal Battery CapacityIf there are more than 1 cells in the battery in parellel connection the nominal resulting battery capacity is the sum of capacity of cells 300 mAh battery
Wireless ChargingWireless charging (like Qi, PMA) is a kind of near-field electromagnatic power transmission methods. Inductive coupling is created between a mobile device (secondary coil) and a special charger (primary coil), usually docking station or charging pad.  Yes

Geographical AttributesGeographical Attributes: 
Market CountriesCountries where the device was officially sold. Overlap is possible.  USA
Market RegionsRegions where the device was officially sold. Overlap is possible.  North America
Mobile OperatorList of mobile operators (carriers) or distributors which sold the device in their own network Verizon WirelessVerizon Wireless

Datasheet AttributesDatasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2015-09-04 12:54
 

Samsung SM-R730V Gear S2 CDMA (Samsung Orbis)

Samsung SM-R730V Gear S2 CDMA (Samsung Orbis)
Supported Cellular Data Links: cdma Complementary Phone Services: phone Bluetooth Wireless LAN NFC Complementary Satellite Services Supported GLONASS protocol(s) Number of effective pixels: 0.0 MP camera Aux. Camera Number of Pixels : 0.0 MP aux. cam Secondary Camera Number of pixels: 0.0 MP sec. cam Built-in accelerometer Built-in gyroscope Additional sensors: barometer Additional sensors: heartrate Protection from liquids: waterproof Wireless Charging

High Resolution Photos

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samsung gear s2 02
samsung gear s2 01
samsung gear s2 11
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samsung gear s2 03
samsung gear s2 04
samsung gear s2 12

See also

Samsung SM-R735T Gear S2 Classic 3G (Samsung Orbis)
Samsung SM-R735T Gear S2 Classic 3G (Samsung Orbis)
44x46.9x13.4 mm, Samsung Tizen Wearable Platform, Qualcomm Snapdragon 400 MSM8226 (Snapdragon S4 ), 512 MiB RAM, 4 GB ROM, 1.2 inch, 360x360, 300 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-R735A Gear S2 Classic 3G (Samsung Orbis)
Samsung SM-R735A Gear S2 Classic 3G (Samsung Orbis)
44x46.9x13.4 mm, Samsung Tizen Wearable Platform, Qualcomm Snapdragon 400 MSM8226 (Snapdragon S4 ), 512 MiB RAM, 4 GB ROM, 1.2 inch, 360x360, 300 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-R735 Gear S2 Classic 3G (Samsung Orbis)
Samsung SM-R735 Gear S2 Classic 3G (Samsung Orbis)
44x46.9x13.4 mm, Samsung Tizen Wearable Platform, Qualcomm Snapdragon 400 MSM8226 (Snapdragon S4 ), 512 MiB RAM, 4 GB ROM, 1.2 inch, 360x360, 300 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-R735V Gear S2 Classic 3G (Samsung Orbis)
Samsung SM-R735V Gear S2 Classic 3G (Samsung Orbis)
44x46.9x13.4 mm, Samsung Tizen Wearable Platform, Qualcomm Snapdragon 400 MSM8626, 512 MiB RAM, 4 GB ROM, 1.2 inch, 360x360, 300 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-R730S Gear S2 3G (Samsung Orbis)
Samsung SM-R730S Gear S2 3G (Samsung Orbis)
43.9x55.2x13.4 mm, Samsung Tizen Wearable Platform, Qualcomm Snapdragon 400 MSM8226 (Snapdragon S4 ), 512 MiB RAM, 4 GB ROM, 1.2 inch, 360x360, 300 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-R730T Gear S2 3G (Samsung Orbis)
Samsung SM-R730T Gear S2 3G (Samsung Orbis)
43.9x55.2x13.4 mm, Samsung Tizen Wearable Platform, Qualcomm Snapdragon 400 MSM8226 (Snapdragon S4 ), 512 MiB RAM, 4 GB ROM, 1.2 inch, 360x360, 300 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-R730A Gear S2 3G (Samsung Orbis)
Samsung SM-R730A Gear S2 3G (Samsung Orbis)
43.9x55.2x13.4 mm, Samsung Tizen Wearable Platform, Qualcomm Snapdragon 400 MSM8226 (Snapdragon S4 ), 512 MiB RAM, 4 GB ROM, 1.2 inch, 360x360, 300 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-R720 Gear S2 (Samsung Orbis)
Samsung SM-R720 Gear S2 (Samsung Orbis)
42.3x49.8x11.4 mm, Samsung Tizen Wearable Platform, Samsung Exynos 3 Dual 3250, 512 MiB RAM, 4 GB ROM, 1.2 inch, 360x360, 250 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-R732 Gear S2 Classic (Samsung Orbis)
Samsung SM-R732 Gear S2 Classic (Samsung Orbis)
39.9x53.6x11.4 mm, Samsung Tizen Wearable Platform, Samsung Exynos 3 Dual 3250, 512 MiB RAM, 4 GB ROM, 1.2 inch, 360x360, 250 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-R730 Gear S2 3G / Gear A (Samsung Orbis)
Samsung SM-R730 Gear S2 3G / Gear A (Samsung Orbis)
43.9x55.2x13.4 mm, Samsung Tizen Wearable Platform, Qualcomm Snapdragon 400 MSM8226 (Snapdragon S4 ), 512 MiB RAM, 4 GB ROM, 1.2 inch, 360x360, 300 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB (Samsung B6)
2 weeks ago
Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB (Samsung B6)
New F741UZOEXAA, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB (Samsung B6)
2 weeks ago
Samsung SM-F741U1 Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB (Samsung B6)
New F741UZSAXAA, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741R4 (Samsung B6)
2 weeks ago
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741R4 (Samsung B6)
New F741ULGEUSC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741R4 (Samsung B6)
2 weeks ago
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 256GB / SM-F741R4 (Samsung B6)
New F741UZSAUSC, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 256 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741V (Samsung B6)
2 weeks ago
Samsung SM-F741U Galaxy Z Flip6 5G UW Dual SIM TD-LTE US 512GB / SM-F741V (Samsung B6)
New F741ULBEVZW, 71.9x165.1x8.9 mm, Google Android 14 (Upside Down Cake), Qualcomm Snapdragon 8 Gen 3 for Galaxy SM8650-AC (Lanai), 12 GiB RAM, 512 GB ROM, 6.7 inch, 1080x2640, 748x720, 50.1 MP camera, 10.0 MP sec. cam, 4000 mAh battery | All detailsAll details | Add this item to the comparisonAdd to compare

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