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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component NVIDIA
Type Tegra 2 250 T20
Codename Ventana
Year Released 2010
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit
Supported Instruction Set(s) ARMv7-A
Pipeline StagesPipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions. 8 pipeline stages
Number of processor core(s) 2
Type of processor core(s)Type and allocation of processor core(s) 2x ARM Cortex-A9 MPcore

BusesBuses: 
Memory Interface(s):   DDR2 SDRAM , mobile (LP) DDR2 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 667 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 32 bit
Number of data bus channels 1 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 5.34 Gbyte/s
Non-volatile Memory Data Bus WidthMaximum selectable bit width of secondary data (non-volatile storage) bus of memory interface 32 bit
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  NAND Flash Interface


Clock FrequenciesClock Frequencies: 
Recommended Maximum Clock Frequency 1000 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 32 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 1024 Kbyte L2

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 40 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component TSMC

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). NVIDIA GeForce ULP GPU
Number of GPU cores 8-core GPU
GPU Clock 333 MHz GPU

Cellular CommunicationCellular Communication: 

Supported Cellular Data LinksList of supported cellular data links  No

Satellite NavigationSatellite Navigation: 

Supported GPS protocol(s):   No

Additional InformationAdditional Information: 
Special Features 2x Cortex-A9 Harvard Superscalar processor, 32-bit LP-DDR2 (600MHz) and DDR2 SD RAM (667MHz) interface, Enhanced NAND Flash support, High Definition Audio Video Processor (1080p H.264/VC-1/MPEG-4 Video Decode, 1080p H.264 Video Encode), integrated 333MHz NVIDIA GeForce ULP GPU (OpenGL ES 2.0, OpenVG 1.1, EGL 1.4, Programmable pixel shader, Programmable vertex and lighting, Advanced 3D/2D graphics), Up to 12 megapixel camera support, NTSC/PAL TV output, HDMI 1.3

Datasheet AttributesDatasheet Attributes: 

Related Page URL
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2010-03-14 22:30
 
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