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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Texas Instruments
Type OMAP 4440
Year Released 2011
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit
Supported Instruction Set(s) ARMv7
Pipeline StagesPipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions. 8 pipeline stages
Number of processor core(s) 2
Type of processor core(s)Type and allocation of processor core(s) 2x ARM Cortex-A9 MPcore + 2x ARM Cortex-M3

BusesBuses: 
Memory Interface(s):   mobile (LP) DDR2 SDRAM
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 32 bit
Number of data bus channels 2 ch
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  NAND Flash Interface


Clock FrequenciesClock Frequencies: 
Recommended Maximum Clock Frequency 1500 MHz max.

Cache MemoriesCache Memories: 

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 45 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component Texas Instruments

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). IMG PowerVR SGX540 GPU
Number of GPU cores 1-core GPU
GPU Clock 300 MHz GPU

Cellular CommunicationCellular Communication: 

Supported Cellular Data LinksList of supported cellular data links  No

Satellite NavigationSatellite Navigation: 

Supported GPS protocol(s):   No

Additional InformationAdditional Information: 
Special Features dual ARM Cortex-A9 Harvard Superscalar processor core, embedded image signal processor (20MP camera support, 12MP stereo 3D camera support), 2D/3D graphics acceleration (IVA 3), OpenGL ES v2.0, OpenGL ES v1.1, OpenVG v1.1, EGL v1.3, SmartReflex 2 technologies, M-shield mobile security, ARM TrustZone, HDMI 1.4 3D output, Composite and S-video TV output, XGA/WXGA 16M-color (24-bit definition) display support, High Speed USB 2.0 On-The-Go support, 1080p 60fps video decode, 1080p 30fps video encode, 1080p stereoscopic 3D (S3D) video encode/decode, TWL6040 power management

Datasheet AttributesDatasheet Attributes: 

Related Page URL
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2011-02-18 12:25
 
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