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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Samsung
Type Exynos 4 Dual 4212
Year Released 2012
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit
Supported Instruction Set(s) ARMv7
Pipeline StagesPipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions. 8 pipeline stages
Number of processor core(s) 2
Type of processor core(s)Type and allocation of processor core(s) 2x ARM Cortex-A9 MPcore

BusesBuses: 
Memory Interface(s):   mobile (LP) DDR SDRAM , DDR2 SDRAM , mobile (LP) DDR2 SDRAM , DDR3 SDRAM
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 64 bit
Number of data bus channels 1 ch
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  eMMC 4.5 , moviNANDmoviNAND is a multimedia card (MMC) controller and onboard firmware developed by Samsung in 2006 , NAND Flash Interface , SATASATA revision 1.0 (2003) offering 1.5 Gbit/s data rate


Clock FrequenciesClock Frequencies: 
Recommended Maximum Clock Frequency 1500 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 32 Kbyte D-Cache

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 32 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component Samsung

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). ARM Mali-400 GPU
Number of GPU cores 4-core GPU
Dedicated Graphics MemoryDedicated operative memory (video RAM, VRAM) 0.25 MiB

Cellular CommunicationCellular Communication: 

Supported Cellular Data LinksList of supported cellular data links  No

Satellite NavigationSatellite Navigation: 

Supported GPS protocol(s):   Yes

Additional InformationAdditional Information: 
Special Features dual ARM Cortex-A9 Harvard Superscalar processor core, 8-stage pipeline, 64/32-bit Multi-layer AHB/AXI bus, ARM TrustZone, ARM NEON SIMD engine, SDRAM, LPDDR, LPDDR2, DDR2, DDR3 interface, NAND flash, moviNAND, SATA, eMMC interface, embedded GPS module, HDMI 1.4, triple display controller, stereoscopic video encode, 1080p video encode, 1080p video decode, audio subsystem, quad-core ARM Mali-400 GPU

Datasheet AttributesDatasheet Attributes: 

Related Page URL
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Final
AddedThe exact time of the datasheet addition 2011-10-02 10:24
 
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