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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Apple
Type A5R2 APL2498
Codename S5L8942
Year Released 2012
FunctionMain function of the component  System-On-a-Chip

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 32 bit
Supported Instruction Set(s) ARMv7
Pipeline StagesPipeline is kind of instruction level parallelism where stages (FETCH, DEC, OP, EXEC, RES, etc.) of instruction execution are separeted and parallelized between neighboring instructions. 8 pipeline stages
Number of processor core(s) 2
Type of processor core(s)Type and allocation of processor core(s) 2x ARM Cortex-A9 MPcore

BusesBuses: 
Memory Interface(s):   mobile (LP) DDR2 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 266 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 64 bit
Number of data bus channels 1 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 4.26 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  moviNANDmoviNAND is a multimedia card (MMC) controller and onboard firmware developed by Samsung in 2006 , NAND Flash Interface , SATASATA revision 1.0 (2003) offering 1.5 Gbit/s data rate


Clock FrequenciesClock Frequencies: 
Recommended Minimum Clock Frequency 800 MHz min.
Recommended Maximum Clock Frequency 1200 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 32 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 1024 Kbyte L2

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 32 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component Samsung

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). IMG PowerVR SGX543 GPU
Number of GPU cores 2-core GPU

Cellular CommunicationCellular Communication: 

Supported Cellular Data LinksList of supported cellular data links  No

Satellite NavigationSatellite Navigation: 

Supported GPS protocol(s):   Yes

Additional InformationAdditional Information: 
Special Features dual ARM Cortex-A9 Harvard Superscalar processor core, 64/32-bit Multi-layer AHB/AXI bus, ARM TrustZone, ARM NEON SIMD engine, dual-channel (64-bit) 266 MHz LPDDR2 SDRAM interface, NAND flash, moviNAND, SATA, eMMC interface, embedded GPS module, HDMI, triple display controller, 1080p video encode, 1080p video decode, audio subsystem, PowerVR SGX543MP2

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Final
AddedThe exact time of the datasheet addition 2012-09-13 11:36
 
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