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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Intel
Type Core M 5th Gen M-5Y71
Codename Broadwell
Year Released 2014
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) IA-64 (x86-64), MMX, SSE, SSE2, SSE3, SSE4, SSE 4.1
Number of processor core(s) 2
Type of processor core(s)Type and allocation of processor core(s) 2x Intel Core M

BusesBuses: 
Memory Interface(s):   DDR3L (LV) SDRAM , DDR3L-RS SDRAM , mobile (LP) DDR3 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 800 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 64 bit
Number of data bus channels 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 25.6 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  Yes


Clock FrequenciesClock Frequencies: 
Internal Systembus Clock 1200 MHz
Recommended Maximum Clock Frequency 2900 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 32 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 512 Kbyte L2
Total L3 Cache 4096 Kbyte L3

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 14 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
Number of Transistors Integrated 1300000000
FabPlant which fabricates the semiconductor component Intel
PinsNumber of pins on the package 1234 pins

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Intel HD Graphics 5300 GPU
GPU Clock 300 MHz GPU

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  No

Communication InterfacesCommunication Interfaces: 
Supported USB Specification:   No
Bluetooth supportThis field specifies the supported BT version  No
Wireless LAN supportThis field enumerates the supported Wi-Fi protocols  No
Supported Audio/Video Interface:   No

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s):   No

Additional InformationAdditional Information: 
Special Features
Dual Intel Core M processor cores, 32 Kbyte instruction cache per core, 32 Kbyte data cache per core, 256 Kbyte L2 cache per core, 4 Mbyte L3 cache, dual-channel 64-bit 667 MHz / 800 MHz LP-DDR3 / 800 MHz DDR3L/DDR3L-RS SD RAM interface (max. 25.6 GB/s), Intel Hyper-Threading Technology, Intel Turbo Boost 2.0 Technology, 300 MHz Intel HD Graphics 5300 GPU (max. 900 MHz), Intel Clear Video HD Technology, Intel Stable Image Platform Program (SIPP) , Intel vPro Technology, Intel Wireless Display, Intel Insider, Intel InTru 3D Technology, Intel Quick Sync Video, Image Signal Processor, Intel Smart Response Technology, eDP/DP/HDMI/SDVO/CRT output support

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2015-01-11 18:16
 
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