 Generel Characteristics:
|
Designer |
Samsung |
| Type: |
Exynos 7 Dual 7270 SC57270 |
| Year Released: |
2016 |
| Function |
Multi-core Application Processor with Modem |
 Architecture:
|
| Width of Machine Word |
64 bit |
| Supported Instruction Set(s): |
ARMv8-A (A32, A64) |
| Type of processor core(s) |
2x ARM Cortex-A53 MPcore |
| Number of processor core(s): |
dual-core |
 Buses:
|
| Memory Interface(s): |
LPDDR3 SDRAM |
| Data Bus Width |
32 bit |
| Number of data bus channels: |
2 ch |
| Non-volatile Memory Interface |
eMMC 5.0
, moviNAND
, NAND Flash Interface
, SATA |
 Clock Frequencies:
|
| Recommended Maximum Clock Frequency: |
N/A |
 Cache Memories:
|
 Technology and Packaging:
|
| Feature Size |
14 nm |
| Semiconductor Technology: |
CMOS |
| Fab |
Samsung |
 Graphical Subsystem:
|
| Embedded GPU |
ARM Mali-T720 GPU |
| Number of GPU cores: |
1-core GPU |
| GPU Clock: |
667 MHz GPU |
 Cellular Communication:
|
| Supported Cellular Data Links |
CSD
, GPRS
, EDGE
, UMTS
, HSUPA
, HSUPA 5.8
, HSDPA
, HSPA+ 21.1
, TD-SCDMA
, TD-HSDPA
, LTE
, LTE 100/50
, LTE 150/50 data links |
 Additional Information:
|
Special Features:
Dual ARM Cortex-A53 Harvard Superscalar processor cores processor cores, ARM TrustZone, ARM NEON SIMD engine, qHD (960x540) display support, embedded, 5 MP camera support, 720p video decode, FM radio support. SiP-ePoP (System-in-Package - embedded Package on Package). For wearable devices. |
 Datasheet Attributes:
|
| Data Integrity |
Preliminary |
| Added |
2016-10-13 10:15 |
All details | 
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