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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Apple
Type A10X Fusion APL1071 / APL1W71
Codename T8011
Year Released 2017
FunctionMain function of the component  System-On-a-Chip

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) ARMv8-A (A32, A64)
Number of processor core(s) 4
Type of processor core(s)Type and allocation of processor core(s) 3x Apple Hurricane + 3x Zephyr cores

BusesBuses: 
Memory Interface(s):   mobile (LP) DDR4 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 1600 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 64 bit
Number of data bus channels 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 51.2 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  eMMC 5.1 , moviNANDmoviNAND is a multimedia card (MMC) controller and onboard firmware developed by Samsung in 2006 , NAND Flash Interface , SATASATA revision 1.0 (2003) offering 1.5 Gbit/s data rate


Clock FrequenciesClock Frequencies: 
Recommended Maximum Clock Frequency 2380 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 64 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 64 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 3072 Kbyte L2
Total L3 Cache 8192 Kbyte L3

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 10 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
FabPlant which fabricates the semiconductor component TSMC

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). N/A
Number of GPU cores 12-core GPU

Cellular CommunicationCellular Communication: 

Supported Cellular Data LinksList of supported cellular data links  No

Satellite NavigationSatellite Navigation: 

Supported GPS protocol(s):   GPS (NMEA 0183)NMEA 0183
Supported GLONASS protocol(s)GLONASS is a global satellite  navigation system operated by Russia.  Yes
Supported BeiDou system (BDS)BeiDou System (BDS) is a Chinese satellite navigation system. Its global variant is the BeiDou-2 alias COMPASS.  B1IBeiDou-2 (COMPASS) B1I signal transmitted by BDS-2 satellites is centered at 1561.098 MHz, featuring a QPSK(2) modulation BeiDou receiver

Additional InformationAdditional Information: 
Special Features 3x high-performance Apple Hurricane 64-bit ARMv8-compatible (AArch32-AArch64) Harvard Superscalar processor cores + 3x high-efficiency Apple Zephyr 64-bit ARMv8-compatible (AArch32-AArch64) Harvard Superscalar processor cores, HMP, ARM VFPv4, HDMI, 2160p video encode, 2160p video decode, OpenGL ES 3.0, OpenCL 2.0, Vulkan 1.0, DirectX 12

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2017-06-06 18:48
 
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