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Generel CharacteristicsGenerel Characteristics: 
DesignerCompany which designed the semiconductor component Apple
Type A12Z Bionic APL1083
Codename T8027
Year Released 2020
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) ARMv8.3-A (A32, A64)
Number of processor core(s) 8
Type of processor core(s)Type and allocation of processor core(s) 4x Apple Vortex + 4x Apple Tempest cores

BusesBuses: 
Memory Interface(s):   LPDDR4x SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 2133 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 64 bit
Number of data bus channels 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 68.26 Gbyte/s
Non-volatile Memory InterfaceInterface which determines physical layer towards the NV memory  eMMC 5.1Complies with embedded MMC 5.1 specification released in 2015 , moviNANDmoviNAND is a multimedia card (MMC) controller and onboard firmware developed by Samsung in 2006 , NAND Flash Interface , SATASATA revision 1.0 (2003) offering 1.5 Gbit/s data rate , SATA IISerial AT Attachment revision 2.0 (released in 2004) or 2.x offering 3 Gbit/s data rate , UFS 2.1UFS revision 2.1 (released in 2016) defines single-lane 600 MB/s or dual-lane 1.2 GB/s NAND flash EEPROM interface


Clock FrequenciesClock Frequencies: 
Recommended Maximum Clock Frequency 2480 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 128 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 128 Kbyte D-Cache
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 10240 Kbyte L2
Total L3 Cache 8192 Kbyte L3

Technology and PackagingTechnology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 7 nm
Semiconductor Technology:   FinFETMultigate (usually double-gate) MOSFET transistor technology
Number of Transistors Integrated 10000000000
FabPlant which fabricates the semiconductor component TSMC

Graphical SubsystemGraphical Subsystem: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Apple G11G GPU
Number of GPU cores 8-core GPU

Cellular CommunicationCellular Communication: 
Supported Cellular Data LinksList of supported cellular data links  No

Communication InterfacesCommunication Interfaces: 
Supported USB Specification:   USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate. , USB 3.0 / USB 3.1 Gen 1 / USB 3.2 Gen 1x1Released in November 2008, USB 3.0 specification introduced USB SuperSpeed enabling devices to communicate at 5 Gbit/s. Later renamed as USB 3.1 Gen 1, then  USB 3.2 Gen 1x1 , USB 3.1 Gen 2 / USB 3.2 Gen 2x1Released in July, 2013, USB 3.1 Gen 2 specification introduced USB SuperSpeed+ enabling devices to communicate at 10 Gbit/s data rate. USB 3.1 standard is backward compatible with USB 2.0 and 3.0. Later renamed as USB 3.2 Gen 2x1
Bluetooth supportThis field specifies the supported BT version  No
Wireless LAN supportThis field enumerates the supported Wi-Fi protocols  No
Supported Audio/Video Interface:   HDMI (Unspecified) , DisplayPort (Unspecified) , HDMI 1.3HDMI 1.3 specification was published June 22, 2006 with increased clock speed up to 340 MHz and resolution up to 2560x1600 at 60fps. , HDMI 1.3aHDMI 1.3a specification was published on November 10, 2006 , HDMI 1.4HDMI 1.4 specification was published May 28, 2009 and introduces HDMI Type D micro connector and 4K video support. , HDMI 1.4aHDMI 1.4a specification was published on March 4, 2010. , HDMI 2.0 (UHD)HDMI 2.0 specification was published on September 4, 2013 with increased clock speed up to 600 MHz and resolution up to 4096x2160 at 60fps.

Satellite NavigationSatellite Navigation: 
Supported GPS protocol(s):   GPS (NMEA 0183)NMEA 0183
Supported Galileo service(s)Galileo is a global satellite  navigation system operated by European Union and the European Space Agency.  Yes
Supported GLONASS protocol(s)GLONASS is a global satellite  navigation system operated by Russia.  Yes
Supported BeiDou system (BDS)BeiDou System (BDS) is a Chinese satellite navigation system. Its global variant is the BeiDou-2 alias COMPASS.  B1IBeiDou-2 (COMPASS) B1I signal transmitted by BDS-2 satellites is centered at 1561.098 MHz, featuring a QPSK(2) modulation BeiDou receiver

Additional InformationAdditional Information: 
Special Features
4x high-performance 3 GHz Apple Vortex 64-bit ARMv8-compatible (AArch32-AArch64) Harvard Superscalar processor cores (128 Kbyte L1 data cache per core, 128Kbyte L1 instruction cache per core) + 4x high-efficiency 1.6 GHz Apple Tempest 64-bit ARMv8-compatible (AArch32-AArch64) Harvard Superscalar processor cores (32 Kbyte L1 data cache per core, 32 Kbyte L1 instruction cache per core), HMP, ARM VFPv4, 2160p video encode, 2160p video decode, OpenCL 2.0, OpenGL 3.0, Vulkan 1.1, DirectX 12

Datasheet AttributesDatasheet Attributes: 

Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2020-03-21 11:55
 
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