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Nokia Lumia 526

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General AttributesGeneral Attributes

BrandBrand name of the device. This may match with the manufacturer Nokia
ModelOne or more (separated by /) specific model name identifies this device Lumia 526
ReleasedOfficial release date 2013 Dec
Hardware designerThe company which designed this device Nokia
ManufacturerThe company which produces this device Nokia
OEM IDThe OEM ID is internal code and refers to a specific variant of the model series RM-997
Device CategorySmartphone, tablet, smart watch, PDA, palmtop, etc. SmartphoneCallular voice-capable usually touchscreen mobile computer which natively runs third-party apps.
Market CountriesCountries where the device was officially sold. Overlap is possible. China

Physical AttributesPhysical Attributes

WidthWidth is horizontally measured between the left and right edges of device according to the default display orientation 64 mm
HeightHeight is vertically measured between the bottom and top edges of device according to the default display orientation 119.9 mm
DepthDepth or thickness is usually the smallest dimension of the device 11.2 mm
DimensionsAll dimensions are maximal values (measured between the furthest points of the device) in closed state 2.52x4.72x0.44 inches
MassThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in grams 124 g
4.37 ouncesThe mass of the device including standard battery and stylus (if any and it can be inserted into the device) measured in ounces

Software EnvironmentSoftware Environment

Platform Windows (mobile-class)Windows embedded for smartphones, PDAs, palmtops, tablets, rugged handhelds, automotive devices and other real-time and embedded applications
Operating SystemPre-installed (usually embedded) operating system which the device was released with. Microsoft Windows Phone 8 GDR3Microsoft Windows Phone 8 GDR3
ChineseSubversion, update version, user interface, defualt language, etc.

Application processor, ChipsetApplication processor, Chipset

CPU ClockFrequency of the square signal which schedules the internal operation of microprocessor (synchronous sequential logic). The current consumed by the processor is approximately proportional to clock rate. 1200 MHz
CPUManufacturer part number and most important characteristics of the IC which includes the main application processor or processors Qualcomm Snapdragon 400 MSM8230 (Snapdragon S4), 2012, 32 bit, dual-core, 16 Kbyte I-Cache, 16 Kbyte D-Cache, 1024 Kbyte L2, 28 nm, Qualcomm Adreno 305 GPUQualcomm Snapdragon 400 MSM8230 (Snapdragon S4), 2012, 32 bit, dual-core, 16 Kbyte I-Cache, 16 Kbyte D-Cache, 1024 Kbyte L2, 28 nm, Qualcomm Adreno 305 GPU

Operative MemoryOperative Memory
RAM TypeType of volatile memory IC which specifies RAM architecture, timing characteristics, refresh mode, voltage levels and physical design of the IC. Two major types of random-access memory is static RAM (SRAM) periodically refreshed dynamic RAM (DRAM). LPDDR3 SDRAM
RAM Capacity (converted)RAM capacity in binary bytes (KiB: 1024 bytes, MiB: 1024 KiB, GiB: 1024 MiB) 1.00 GiB RAM

Non-volatile MemoryNon-volatile Memory
Non-volatile Memory TypeType of NV memory IC which determines storage technology, programming / erasing method and write endurance Flash EEPROM
Non-volatile Memory Capacity (converted)The value of ROM capacity converted to the most appropriate units (KiB: 1024 bytes, KB: 1000 bytes, MiB: 1024 KiB, MB: 1000 KB, GiB: 1024 MiB, GB: 1000 MB) 8.0 GB ROM


DisplayDisplayAll parameters that related to display

Display ResolutionHorizontal and vertical resolution of the primary display 480x800
Display DiagonalThe distance measured between the furthest corners of the display 101 mm
4 inch
Horizontal Full Bezel WidthDefined as the sum of width of left and right vertical display bezels. If the display panel is located in the middle width of left and right bezels are the same and their width is the half of the full bezel width. 12.04 mm
Display Area UtilizationDisplay area per front panel area ratio 59%
Pixel DensityIndicates the number of pixels per inch 235 PPI
Display TypePossible options: Color/ monochrome e-ink, STN, PM-OLED, AM-OLED, TN-TFT, IPS TFT, ASV TFT, MVA TFT, PVA TFT, PLS TFT, etc. Color IPS TFT LCDColor IPS-TFT (In-Plane Switching - Thin Film Transistor) is also called Super TFT LCD. This is an active matrix LCD technology developed by Hitachi Ltd. in 1996.
Display SubtypeBrand name of the subtype/technology of the screen like Super AMOLED, SLCD2/3/5, Retina Display, Reality Display, ClearBalck, etc. ClearBlack (CBD)CBD is a display technology (developed by Nokia) which includes a special polariser filter (to improve outdoor readability), enhanced color accuracy and increased viewing angle.
Number of Display Colors/ScalesMaximal number of displayable colors or scales 16.8M
Display Subpixel SchemeSpecifies how and how many subpixels are pixels consists of. Possible schemes: RGB, RGBG, RGBW, PenTile, Diamond Pixel, etc. RGB MatrixEach pixel has 3 subpixel (Red, Greed, Blue) with the same size. The subpixel order is often R-G-B but B-G-R is also used.
Scratch Resistant ScreenPossible types: Gorilla Glass generations, DragonTrail/X, Sapphire Glass, etc. Yes

Graphical SubsystemGraphical Subsystem
Graphical ControllerManufacturer and part number of the graphics controller IC or commercial name of the intellectual property (IP) if the graphics controller is the part of a chipset Qualcomm Adreno 305

Audio/Video InterfacesAudio/Video Interfaces
A/V OutAudio/Video outputs form a heterogeneous group of interfaces that allow the user to connect the device to various external analog/digital multimedia devices (monitors, projectors, HD TVs) and play multimedia content. For example: MHL, DisplayPort, HDMI, e Yes
ProprietaryThis connector type is not standardized any may be applied only by one manufacturer within its products.Physical interface of the A/V out port. For example: HDMI D, USB-C, micro-USB or DB25

Audio SubsystemAudio Subsystem

Microphone(s) mono
Loudpeaker(s) mono

Cellular PhoneCellular Phone

Supported Cellular NetworksList of supported cellular networks with band names. For example GSM900 refers to the GSM system with the 890-915 MHz uplink and 935-960 downlink bands. GSM850GSM850 phones support GSM 850 MHz band (downlink: 869.2 MHz - 894.2 MHz, uplink: 824.2 MHz - 849.2 MHz) , GSM900GSM900 phones support P-GSM (Primary GSM) 900 MHz band (downlink: 935.0 MHz - 960.0 MHz, uplink: 890.0 MHz - 915.0 MHz) and may support E-GSM (Extended GSM) 900 MHz band (downlink: 925.0 MHz - 960.0 MHz, uplink: 880.0 MHz- 915.0 MHz. , GSM1800GSM1800 phones support GSM / DCS / PCS 1800 MHz band (downlink: 1805.2 - 1879.8 MHz, uplink: 1710.2 - 1784.8 MHz)., GSM1900GSM1900 phones support PCS 1900 MHz band (downlink: 1930.2 - 1989.8 MHz, uplink: 1850.2 - 1909.8 MHz) , TD-SCDMA2000TD-SCDMA2000 phones support TD-SCDMA 2000 MHz band (2010 - 2025 MHz)
Supported Cellular Data LinksList of supported cellular data links and rates. GPRSGeneral Packet Radio Service, EDGEEnhanced Data Rates for GSM Evolution also known as Enhanced GPRS (EGPRS), TD-SCDMATime Division Synchronous Code Division Multiple Access is the implementation of UMTS  (3G) cellular network in China., TD-HSDPA
SIM Card SlotSupported Subscriber Identification Card (SIM) Format like mini-SIM, micro-SIM, nano-SIM, embedded SIM, etc. Yes
Complementary Phone ServicesPossible extras: voice transmission, voice speaker, vibration, speakerphone, active noise cancellation, PTT, HD Voice, VoLTE, etc. Speakerphone, Vibrate, Voice speakerDedicated voice speaker is located near to the ear when talking and optimized for the spectrum and peak-to-peak range of the human voice., Voice transmissionDevice is able to receive and transmit voice over cellular network

Secondary Cellular PhoneSecondary Cellular Phone
Sec. Supported Cellular Networks No

Control PeripheralsControl Peripherals

Touchscreen TypeDetermines how the touchscreen module senses the touch of the screen Capacitive multi-touch
Touchscreen Simultaneous Touch PointsDetermines how many touches the touch-sensitive screen module is able to simultaneously detect Yes

Communication InterfacesCommunication Interfaces

Expansion InterfacesNon-volatile memory and/or I/O expansion interfaces. For example: microSD, microSDXC, SDHC, CF II., PCMCIA III., etc. TransFlash, microSDSupports memory cards with capacity of up to 2GB and may comply with some (not HC) memory cards with higher capacity than 2GB  , microSDHCA micro-SDHC-capable device supports High Capacity (SD 2.0/HC) memory cards with capacity of up to 32GB., microSDXCA microSDXC-capable device supports eXtended-Capacity memory cards with capacity of up to 128 GB, 256 GB or 2 TB.
USBUSB is a common high-speed serial bus standard that allows data and power transfer between the mobile device and another computer. Version of USB identifies USB standard. USB 2.0Released in April 2000, USB 2.0 specification introduced USB Hi-Speed enabling devices to communicate at 480 Mbit/s data rate.
USB Speed Rate:  USB HS (480 Mbps)
USB ServicesPossible services: USB power supply, USB charging, USB fast charging, USB host, OTG, etc. USB chargingThe device is able to charge its battery supplied from the USB port.
USB Connector:  USB Micro-B (Micro-USB)
BluetoothIEEE 802.15 is a short-range radio technology standard that allows transfer of data, and the use of accessories such as wireless audio devices and printers. This field specifies the supported BT version. Bluetooth 4.0
Wireless LANWireless LAN / WLAN / Wi-Fi: 802.11 defines a medium-range wireless data link that allows for internet access and data transfer. This field enumerates the supported protocols (like 802.11n). 802.11a, 802.11b, 802.11g, 802.11n
Wireless ServicesPossible extras: Miracast, DLNA, WiFi Tethering, UPnP, WiFi Display, AirPlay, etc. DLNADLNA (Digital Living Network Alliance) over Wireless LAN

Multimedia BroadcastMultimedia Broadcast

FM Radio Receiver Unknown


Satellite NavigationSatellite Navigation

Complementary GPS ServicesPossible extras: S-GPS, A-GPS, Geotagging, TMC, QuickGPS, QZSS, etc. A-GPS, Geotagging, QuickGPS
Supported GLONASS protocol(s)GLONASS is a global satellite  navigation system operated by Russia. Yes

Built-in Digital CameraBuilt-in Digital CameraPrimary camera usually has better imaging capabilities than secondary camera if any

Camera PlacementRefers to the placement of the primary camera on the device Rear
Camera Image SensorRefers to the semiconductor technology of image sensor CMOSComplementary MOS circuit
Number of pixels 5.0 MP cam
Optical ZoomA feature that changes the focal length of the lens of a camera. Optical zoom requires the lens to move in and out, providing high-quality close ups from a distance 1 x
Digital ZoomDigital zoom is an image signal processing method which cuts out and enlarges a desired part of the captured image while losing the rest of the image 4 x
FocusPossible focus methods: fixed focus, manual focus, CD AF, PD AF, LASER AF, etc. CD AFContrast-detection (CD) is a passive autofocus method without distance measurement which adjusts the optical system until maximum contrast is measured through the lens.
Camcorder Resolution 1280x720 pixel
30 fps
Built-in FlashA flash is used to brighten dark areas when taking photographs; is also used as a flashlight No
Camera Extra FunctionsPossible extras: 3D photo,  EIS, EIS (video), OIS, Face detection, HDR photo, HDR video, Macro mode, Panorama Photo, Red-eye reduction, Refocus, Smile detection, Slow motion video, etc. EISEIS (or digital IS) uses further buffer pixels around the active pixel matrix and dinamically shifts the recorded image in 4 direction to compensate the motion of the camera., EIS (video), Touch focus, Macro modeAn autofocus feature that allows for close-up photographs to be taken with the onboard digital camera, Face detection

Built-in Secondary Digital CameraBuilt-in Secondary Digital CameraWidely used for video telephony or taking selfies

Secondary Camera Sensor No

Power SupplyPower Supply

BatteryBattery technology Lithium-ion
removablePossible options: removable, built-in
Nominal Battery Capacity 1430 mAh

Ingress Protection Ingress Protection

Protection from solid materialsIngress Protection Standards. IP First digit: Protection from solid objects or materials Yes
Protection from liquidsIngress Protection Standards. IP Second digit: Protection from liquids Yes

Built-in SensorsBuilt-in Sensors

Built-in compassBuilt-in electroinc compass types: 1D, 2D, 3D Yes
Built-in accelerometerAn internal component that senses acceleration components of the device.  Used for automatic screen rotation and for games and applications that rely on acceleration measurement  on X, Y, and Z axis. Possible types: 1D, 2D, 3D Yes
Built-in gyroscopeAn internal component that senses the orientation of the device.  Used for automatic screen rotation and for games and applications that rely on the devices position in the X, Y, and Z axis. Possible types: 1D, 2D, 3D Yes
Additional sensorsBuilt-in ambient (barometer, temperature, altimeter, light, etc.), biometric (fingerprint, HR, step, etc.) and comfort (hall sensor, gesture sensor, proximity, etc.) sensors Light sensorBy measuring the intensity of the ambient light device may control the brightness level of the screen, Prox. sensorBased on this sensor signal device may control the volume of the voice speaker or dim the display during a call

Datasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Preliminary
AddedThe exact time of the datasheet addition 2013-11-09 12:07
 
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