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Intel Core 7th Gen i3-7100U (Kaby Lake) datasheet

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Generel Characteristics
DesignerCompany which designed the semiconductor component Intel
Type Core 7th Gen i3-7100U
FabPlant which fabricates the semiconductor component Intel
Codename Kaby Lake
Year Released 2016
FunctionMain function of the component Multi-core Application Processor

ArchitectureArchitecture
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) IA-64 (x86-64), MMX, SSE, SSE2, SSE3, SSE4, SSE 4.1, SSE 4.2, AV
Number of processor core(s) 2
Type of processor core(s)Type and allocation of processor core(s) 2x Intel Kaby Lake-U


BusesBuses
Memory Interface(s) DDR3L (LV) SDRAM, mobile (LP) DDR3 SDRAM, DDR4 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 1066 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 64 bit
Number of data bus channels 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 34.11 Gbyte/s

Clock FrequenciesClock Frequencies
Recommended Maximum Clock Frequency 2400 MHz max.

Cache MemoriesCache Memories
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 32 Kbyte D-Cache
Number of L1 Cache Ways:  8-way
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 512 Kbyte L2
Number of L2 Cache Ways:  4-way
Total L3 Cache 3072 Kbyte L3

Technology and Packaging
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 14 nm
Semiconductor Technology CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
PinsNumber of pins on the package 1356 pins

Additional Features
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Intel HD Graphics 620 GPU
Number of GPU cores 4-core GPU
GPU Clock 300 MHz
Special Features Dual Intel Kaby Lake-U processor cores, 32 Kbyte instruction cache per core, 32 Kbyte data cache per core, 256 Kbyte L2 cache per core, 3 Mbyte L3 cache (Intel Smart Cache,16-way set associative), dual-channel 64-bit DDR4-2133, LPDDR3-1866, DDR3L-1600 SD RAM interface (max. 34.1 GB/s), Intel Hyper-Threading Technology, Intel Virtualization Technology, 300 MHz Intel HD Graphics 620 GPU (max. 1 GHz), DirectX 12. OpenGL 4.4, Intel Clear Video HD Technology, Intel HD Audio Technology, Intel Wireless Display, Intel Insider, Intel InTru 3D Technology, Intel Quick Sync Video, Image Signal Processor, 4K eDP/DP/HDMI output support, USB 3.0 support
Supported GPS protocol(s) Yes


Datasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Preliminary
AddedThe exact time of the datasheet addition 2016-12-06 23:01
 
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