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Intel Core m3 7th Gen m3-7Y30 (Kaby Lake) datasheet

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Generel Characteristics: 
DesignerCompany which designed the semiconductor component Intel
Type Core m3 7th Gen m3-7Y30
FabPlant which fabricates the semiconductor component Intel
Codename Kaby Lake
Year Released 2016
FunctionMain function of the component  Multi-core Application Processor

ArchitectureArchitecture: 
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) IA-32 (x86), IA-64 (x64), SSE4, SSE 4.1, SSE 4.2, AVX 2.0
Number of processor core(s) 2
Type of processor core(s)Type and allocation of processor core(s) 2x Intel Kaby Lake-Y


BusesBuses: 
Memory Interface(s):   DDR3L (LV) SDRAM, mobile (LP) DDR3 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 933 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 64 bit
Number of data bus channels 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 29.86 Gbyte/s

Clock FrequenciesClock Frequencies: 
Recommended Minimum Clock Frequency 1000 MHz min.
Recommended Maximum Clock Frequency 2600 MHz max.

Cache MemoriesCache Memories: 
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 32 Kbyte D-Cache
Number of L1 Cache Ways:  8-way
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 512 Kbyte L2
Number of L2 Cache Ways:  4-way
Total L3 Cache 4096 Kbyte L3

Technology and Packaging: 
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 14 nm
Semiconductor Technology:   CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
PinsNumber of pins on the package 1515 pins

Additional Features: 
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Intel HD Graphics 615 GPU
Number of GPU cores 24-core GPU
GPU Clock 300 MHz
Special Features Dual Intel Core-M Kaby Lake Y processor cores, 32 Kbyte instruction cache per core, 32 Kbyte data cache per core, 256 Kbyte L2 cache per core, 4 Mbyte SmartCache, dual-channel 64-bit 933 MHz LPDDR3-1866 / 64-bit 800 MHz DDR3L-1600 SD RAM interface (max. 29.8 GB/s), 300 MHz Intel Iris Graphics 615 EU24 GPU (max. 900 MHz), triple display support, DirectX 12 support, OpenGL 4.4, Intel Clear Video HD Technology, Intel Speed Shift Technology, Intel Wireless Display, Intel Turbo Boost Technology, Intel Hyper-Threading Technology, Intel Insider, ISP, Thermal Monitoring Technologies, eDP/DP/HDMI/DVI, HDMI 1.4 (4K), DisplayPort (4K)


Datasheet Attributes: 
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b  Preliminary
AddedThe exact time of the datasheet addition 2017-03-10 17:24
 
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