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Intel Celeron N3350 (Apollo Lake) datasheet

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Generel Characteristics
DesignerCompany which designed the semiconductor component Intel
Type Celeron N3350
FabPlant which fabricates the semiconductor component Intel
Codename Apollo Lake
Year Released 2016
FunctionMain function of the component Multi-core Application Processor

ArchitectureArchitecture
Width of Machine WordMaximum bitwidth of ALU operands. Width of machine word can also be defined in different ways (register width, instruction width, etc.) in case of recent microprocessors. 64 bit
Supported Instruction Set(s) IA-64 (x86-64), MMX, SSE, SSE2, SSE3, SSE4, SSE4.1, SSE 4.2
Number of processor core(s) 2
Type of processor core(s)Type and allocation of processor core(s) 2x Intel Goldmont


BusesBuses
Memory Interface(s) DDR3L (LV) SDRAM, mobile (LP) DDR3 SDRAM, mobile (LP) DDR4 SDRAM
Max. Clock Frequency of Memory IFClock frequency of fastest supported memory interface 1200 MHz
Data Bus WidthMaximum selectable bit width of primary data bus (RAM) of memory interface 64 bit
Number of data bus channels 2 ch
Max. Data RateMaximal throughput of the fastest supported memory interface in 1000 megabyte per seconds units. 38.4 Gbyte/s

Clock FrequenciesClock Frequencies
Internal Systembus Clock 1100 MHz
Recommended Maximum Clock Frequency 2400 MHz max.

Cache MemoriesCache Memories
L1 Instruction Cache per CoreCapacity of level 1 instruction cache per processor core 32 Kbyte I-Cache
L1 Data Cache per CoreCapacity of level 1 data cache per processor core 24 Kbyte D-Cache
Number of L1 Cache Ways:  8-way
Total L2 CacheCapacity of level 2 cache shared between processor core(s) 2048 Kbyte L2
Number of L2 Cache Ways:  16-way

Technology and Packaging
Feature SizeThe minimum physical dimension in the integrated circuit which can be fabricated with the given semiconductor technology 14 nm
Semiconductor Technology CMOSComplementary Metal-oxide - Semiconductor Field Effect Transistor
PinsNumber of pins on the package 1296 pins

Additional Features
Embedded GPUManufactuer (or IP designer) and type of embedded graphics coprocessor(s). Intel HD Graphics 500 GPU
Number of GPU cores 12-core GPU
GPU Clock 200 MHz
Special Features 2.4 GHz (Burst Frequency) dual Intel Goldmont processor cores, 8-way 32 Kbyte instruction cache per core, 6-way 24 Kbyte data cache per core, 1024 Kbyte L2 Cache per core, dual-channel 64-bit 933 MHz DDR3L-1866 / 933 MHz LPDDR3-1866 / 1200 MHz LPDDR4-2400 SD RAM interface, Intel Hyper-Threading Technology, 200 MHz Intel HD Graphics 500 GPU (max. 650 MHz), Intel Smart Connect Technology, Intel Wireless Display, Intel Virtualization Technology (VT-x), Intel Clear Video HD Technology, Intel Quick Sync Video, Intel Clear Video Technology, USB 3.0 support
Supported GPS protocol(s) Yes


Datasheet Attributes
Data IntegrityData integrity level determines the integrity of the published information. Final datasheets are not intended to be modified in the future, preliminary ones can be based on unofficial information or speculations, incomplete ones are also preliminary b Preliminary
AddedThe exact time of the datasheet addition 2017-03-15 12:44
 
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